Industry 5.0 is revolutionizing manufacturing. Future 6G wireless networks will connect us in new and exciting ways. And artificial intelligence is poised to transform every part of our lives.
We don’t yet know how advances in these and other areas will change our world. But we do know that AMD, building on years of leadership from Xilinx, will be there to help enable every groundbreaking technology that innovators dream up.
AMD acts as a catalyst, making next-generation compute technology a reality through high-performance emulation and prototyping. Time after time, we build breakthrough hardware—adaptive SoCs and FPGAs—designed to facilitate verification of increasingly complex semiconductors and shift software validation to the left in the design cycle.
AMD Xilinx Video SDK 3.0 brings additional enhancements to the already feature-rich Video SDK 2.0. It is now available to Alveo™ U30 media accelerator card users through on-premises setups (support by AWS’s Amazon EC2 VT1 instances coming soon). With Video SDK 3.0 and a multimedia framework/toolkit (such as GStreamer, FFmpeg, and XMA), users can continue to cost-effectively scale their live video transcoding with even greater ease.
The multimedia needs of today’s modern house of worship, enterprise workplace, and even professional video studio has grown significantly in the past 10 years. Today’s content creators demand equipment and infrastructure that supports high-quality, low-latency video free from the restrictions imposed by traditional baseband video interfaces such as HDMI, DisplayPort, or SDI. Creators want long transmission distances, multi-channel video, and flexible routing of audio and video essences, just to name a few.
In the first of our “any media over any network” series, we highlighted that support for bridging between traditional AV connectivity standards and Ethernet-based IP networks is a key function required in many multimedia systems. Next, we’ll take a closer look at the options designers have when adopting Ethernet for AV transport using AMD adaptive SoCs.
Building on the success of the AMD Zynq™ UltraScale+™ MPSoCs and AMD Artix™ UltraScale+ FPGAs, AMD is extending the UltraScale+ family with two new devices.
The new AU7P and ZU3T devices are based on the 16 nm FinFET process for low power, high performance-per-watt, and small form factor applications. These small, low cost, and low power entry points to the programmable logic (PL) transceiver-based UltraScale+ family offer improved features such as high IO-to-logic density, UltraRAM, DSP, etc.
The DVB-S2X standard is very popular for satellite communication. Its outstanding error correction performance allows it to achieve excellent spectral efficiency for a broad range of signal-to-noise ratios (SNRs) - from less than -8dB up to 20dB.
If you’re developing an intelligent edge application that needs processing power in an ultra-compact form factor—we have news for you: the Zynq® UltraScale+™ ZU1 MPSoC is now shipping in all packages including the Ultra-Compact InFO Packaging.
We’re introducing the Zynq® UltraScale+™ RFSoC DFE ZCU670 Evaluation Kit, featuring the ZU67DR, the industry’s only 8T8R, 400 MHz IBW, adaptable, single-chip O-RU solution. The ZU67DR device incorporates 5G digital front-end (DFE) hardened IP, RF sampling converters, and programmable logic to meet the cost, power, and performance requirements of 4G/5G O-RUs.