Alright lets just assume all the leaks are correct and there will be a Ryzen 3600G (8/16 and 20 Navi CU). On the table it shows that the TDP would be around 95W and how the cost would be like $199.99-$???.
Now this would be a pretty hot chip compared to the other APU's and the price range would also hopefully warrant solder.
You may ask why someone would want a "high end" APU but its mainly because I am building an small itx build that I can take with me on trips / etc. And the reason I want it soldered is so I don't get any thermal throttling in small case like this. (I refuse to use laptops because once something goes out your screwed)
If the High end APU is soldered on the motherboard on a desktop type computer case it will be extremely difficult to upgrade the APU in the future. The only processors that I know of being soldered are in some old or certain laptops, depending on the type of Motherboard socket it uses.
I would think you might try and locate a motherboard with AMD Embedded graphics on it that would fit your small computer case. It would be the same as having a soldered APU in many ways.
But then again, this is just my opinion.
Sorry I may not of been too specific. But what I was referring to is using solder as the TIM. (Not solder to the motherboard) Currently they are using thermal paste and I know you don't get as good temps. (It's not uncommon to get 10c-20c drop if someone were to replace the thermal paste with LM)
Here is from another current AMD Thread that asked a similar question. Seems like for the Ryzen 2xxx AMD reverted back to using solder for its IHS Casing instead of TIM. So it is a good chance that AMD will continue the same with the Ryzen 3xxx: Ryzen 3 2300X/2500X use TIM, or it's soldered? The article I posted did mention that AMD APUs uses TIM instead of solder, so I presumed when the article mentioned that the Ryzen 2xxx series will be soldered it will also included the Ryzen 2xxx APUs.