This part ( XC4VFX20-10FFG672I ) contain Lead in 2 locations based on the old FMD ( https://www.xilinx.com/content/dam/xilinx/support/documents/package_specs/pk091_ffg672.pdf)
- Solder Bump ==> 37 %
- Substrate ==> 0.21 %
So the part should be Not Compliant based on the percentage above threshold
Based on Location
- Solder Bump ==> 37 % (Compliant with Exemption 15 )
- Substrate ==> 0.21 % ( 6(C) )
But based on the new FMD ( https://www.xilinx.com/content/dam/xilinx/support/documents/package_specs/pk1136_virtex-4-ffg672.pdf ) the part is Compliant
As the supplier publish PCN ( https://docs.xilinx.com/v/u/en-US/XCN19005 ) contain
Xilinx will begin cross-shipping the new material set for C4 bumps, substrate, and underfill on February 10, 2021. Until the cross-ship date, products with “G” packages will only be shipped with the eutectic material set. After the cross-ship date, the products with “G” packages will be shipped with either eutectic or lead-free material sets. All products with “G” packages are expected to ship with the lead-free material set when the RoHS directive removes Exemption 15a
so we need to confirm if the part has 2 status or now it is compliant based on the updated FMD
