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Helping DFI Harness High-Performance Processing Power in Ultra Compact Single-board Computers

Alisha_Perkins
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Visitors to the recent Embedded World 2022 conference in Nuremburg, Germany – approximately 18,000 embedded experts from 76 countries – enjoyed a remarkable showcase of technology innovations this year at the 20th annual event. AMD was thrilled to take part, and it was the perfect opportunity to unveil the newest evolution in the AMD Ryzen™ Embedded processor family – and cast a spotlight on some of the leading-edge, AMD processor-powered products from across our partner ecosystem.

AMD Ryzen™ Embedded R2000 Series SoCs, officially launched at the event, were enthusiastically received by visitors and attending media, generating headlines around the world. Tom’s Hardware published an excellent summary of the many advantages achieved with the AMD Ryzen™ Embedded R2000 SoCs, including the 2X boosted core count1[1] and 81% boosted graphics performance[2] generational uplift. Additionally, AMD Ryzen™ Embedded R2000 SoCs’ have an impressive support for up to four independent displays, and plan to make the R2000 Series available for up to 10 years.

The highlights don’t stop there though – AMD Ryzen™ Embedded R2000 Series SoCs also deliver 2X the I/O connectivity compared to legacy R-Series SoCs, with low thermal design power (TDP) profiles spanning from 12W to 54W to help enable improved thermal agility for compact system designs with lower BOM costs. It’s the ideal embedded processing solution for compute and graphics intensive applications including industrial PCs, HMIs, thin clients, Mini PCs and more.

 

SCALABILITY ADVANTAGES

AMD Ryzen™ Embedded R2000 Series SoCs provide system designers with high performance, optimized power, and sharp graphics, with a seamless upgrade path from legacy R-Series SoCs. The ongoing technology innovation invested in the AMD Ryzen™ Embedded R-Series SoC family has drawn rave reviews from our partner ecosystem, and scalability is a big reason why.

Scalable up to four CPU cores/eight threads and up to eight graphic compute units (CUs), AMD Ryzen™ Embedded R2000 Series SoCs equip designers with the agility to scale the performance and power efficiency of their product portfolios, addressing use cases from simple to complex with one unified processing platform. This is a major benefit for partners like DFI, who’ve embraced this scalability and agility to innovate exciting new R-Series-based product designs.DFI LOGO_RGB(透明底).png

BIG BENEFITS IN A TINY FOOTPRINT

AMD was honored to welcome DFI as a guest at Embedded World 2022, where it wowed attendees with a preview of its brand new PCSF51 single-board computer (SBC) arriving to market later this year – a 1.8” SBC that harnesses high performance processing power in an impossibly compact form factor.

This isn’t the first time DFI has leveraged AMD Ryzen™ Embedded R-Series SoCs to achieve a tiny, versatile Raspberry Pi-like size profile. To underpin its earlier-generation “Industrial Pi” SBC, the GHF51, DFI needed a high-performance processing platform with a thermal profile optimized for extremely compact IIoT systems – AMD Ryzen™ Embedded R1000 Series SoCs were the perfect complement (read the full case study here).

"DFI is innovative in designing small-size computers with exceptional graphic performance for the industrial and embedded fields including casinos, gaming, automation, machine vision, healthcare and digital signage,” commented Jarry Chang, Product Center General Manager, DFI. “With the groundbreaking AMD Ryzen™ Embedded R2000 Series, we expect to see many new opportunities for our products to take our customers' applications to a brand-new level through the advanced graphic processing and computing capabilities.”

The processing advantage made possible by AMD Ryzen™ Embedded R-Series SoCs has been a major asset for DFI in its ongoing initiative to pack increasing amounts of computing horsepower into compact, thermally adept, ruggedized enclosures. Targeted for use in industrial application development, robotics, edge computing, vision systems and much more, DFI SBCs powered by AMD Ryzen™ Embedded R-Series SoCs can also help to bring advanced AI inference capabilities to bear.

“For applications with strict space constraints, we are currently developing a new, small form factor single board computer that combines our specialized miniaturization technology with the AMD Ryzen Embedded R2000 for graphics-demanding, ultra-tiny, edge computing solutions,” continued Chang. “Expectations are to further reduce current edge applications' size with better overall imaging and machine vision analysis performance."

To learn more about the myriad embedded design benefits enabled with AMD Ryzen™ Embedded R2000 Series SoCs, visit https://www.amd.com/en/products/ryzen-embedded-r2000-series

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[1]  Ryzen™ Embedded R2000 SoC offers up to 4 CPU cores. Ryzen™ Embedded R1000 SoC offers up to 2 CPU cores. EMB-178

[2] Testing conducted by AMD Embedded Software Engineering Labs as of June 1st, 2022 on the Ryzen™ Embedded R2514 and Ryzen™ Embedded R1606G processors on AMD R2000 Development platform running Windows 10 Enterprise version 21H2 on 3DMark® 11-3DMarkscore. The R2514 system used DDR4-2667 RAM, AMD Radeon™ Graphics (driver version: 22.20-220506a-379436E) and BIOS TBP1000B. The R1606G system used DDR4-2400 RAM, AMD Radeon™ Graphics (driver version: 21.50.18-220315a-378119C), and BIOS RBB1208B. Results may vary. EMB-182

 

 

About the Author
Alisha Perkins leads the marketing team for the Embedded Solutions Group at AMD. She has worked as a marketing professional in the semiconductor industry for the past 12 years.