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Leadership Performance for Technical Computing Workloads

dan_mcnamara
Staff
Staff
0 0 2,990

Last November, AMD unveiled the newest addition to the EPYC™ processor lineup. AMD EPYCTM 7003 Series processors with AMD 3D V-Cache™ technology, formerly code-named “Milan-X,” were specifically engineered to excel at technical computing workloads.(1) The world’s first server CPUs with AMD 3D chiplet technology, these new AMD EPYC™ 7003 Series processors offer triple the L3 cache compared to standard AMD EPYC™ 7003 Series processors—enabling breakthrough per-core performance.(2) Now, companies doing advanced product design can run more simulation jobs in a day - accelerating development cycles and getting products to market faster. Today, AMD adds four of these processors to the EPYC 7003 lineup with core counts ranging from 16 through 64.

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Under the Hood
AMD EPYC™ processors with AMD 3D V-Cache™ technology are the first to leverage true 3D die stacking with a copper-to-copper, hybrid bonding “bumpless” design. This methodology enables extraordinary interconnect density—200X greater than current 2D technologies, and 15X greater than other 3D technologies using solder bumps.(3,4) Expanded interconnect density translates to lower latency, higher bandwidth, and greater thermal efficiencies—all contributing to compelling performance gains for technical computing workloads.

Leaner and More Efficient
With over 250 performance world records, 3rd Gen EPYC delivers leadership performance for general purpose computing. Thanks to the additional L3 cache and resultant performance uplift, AMD EPYC™ processors with AMD 3D V-Cache™ technology drive unprecedented performance uplift for technical computing—increasing design fidelity and accelerating innovation. Further, by enabling more simulation jobs per day, these processors help drive down the number of servers needed to perform the same amount of work—helping to lower TCO by reducing power consumption and space needed - better supporting an organization’s sustainability goals.

Results and Designs - FASTER
Leading ISV partners are seeing significant workload performance gains for technical workloads on AMD EPYC™ processors with AMD 3D V-Cache™ technology. These performance improvements can allow customers to innovate faster, speed time to market, and increase their competitive advantage.

ALTAIR
Altair’s testing showed that AMD EPYC™ processors with AMD 3D V-Cache™ technology enabled accelerated CFD analysis speed by 1.5X on Altair® AcuSolve® and impact analysis speed by 1.8X with Altair® Radioss™ compared to standard AMD EPYC™ 7003 Series processors.(5)

ANSYS
With AMD EPYC™ processors with AMD 3D V-Cache™ technology, Ansys testing showed performance uplifts of up to 80% for Ansys® Fluent® compared to standard AMD EPYC™ 7003 Series processors, empowering customers to increase design fidelity and speed up product development.(6)

SYNOPSYS
Customers can experience the breakthrough performance that comes from AMD EPYC™ processors with AMD 3D V-Cache™ technology, applied to the broad portfolio of Synopsys EDA solutions. Synopsys VCS® unlocks significant performance advantages by leveraging the additional, easily accessible cache to accelerate customer workloads, simulating circuit designs up to 66% faster.(7)

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Witness the Gains for Yourself
Interested in capturing these types of gains for your own technical computing workloads? AMD EPYC™ processors with AMD 3D V-Cache™ technology are now available through leading cloud and hardware solution providers, as well as system integrators.

Learn more by visiting www.amd.com/en/events/epyc 

Footnotes:
1: GD-204: “Technical Computing” or “Technical Computing Workloads” as defined by AMD can include: electronic design automation, computational fluid dynamics, finite element analysis, seismic tomography, weather forecasting, quantum mechanics, climate research, molecular modeling, or similar workloads.
2: MLNX-012: EPYC™ 7003 Processors with 3D V-Cache have 768MB of L3 Cache, while EPYC 7003 processors without 3D V-Cache have 256MB.
3: EPYC-026: Based on calculated areal density and based on bump pitch between AMD hybrid bond AMD 3D V-Cache stacked technology compared to AMD 2D chiplet technology and Intel 3D stacked micro-bump technology.
4: EPYC-027: Based on AMD internal simulations and published Intel data on “Foveros” technology specifications.
5: Source: www.altair.com/amd-epyc-vcache
6: Source: https://www.ansys.com/news-center/press-releases/3-21-22-ansys-collaborates-with-microsoft-to-drive-...
7. MLNX-001A: EDA RTL Simulation comparison based on AMD internal testing completed on 9/20/2021 measuring the average time to complete a test case simulation. comparing: 1x 16C EPYC™ 7373X with AMD 3D V-Cache Technology versus 1x 16C AMD EPYC™ 73F3 on the same AMD “Daytona” reference platform. Results may vary based on factors including silicon version, hardware and software configuration and driver versions.

 

About the Author
Dan McNamara is AMD senior vice president and general manager of the Server Business Unit, with responsibility for driving the company’s high-performance server product line across cloud, enterprise, and ecosystem partners. McNamara holds Bachelor and Master of Science degrees in electrical engineering from the Worcester Polytechnic Institute in Worcester, Massachusetts.