The processing advantage made possible by AMD Ryzen™ Embedded R-Series SoCs has been a major asset for DFI in its ongoing initiative to pack increasing amounts of computing horsepower into compact, thermally adept, ruggedized enclosures. Targeted for use in industrial application development, robotics, edge computing, vision systems and much more, DFI SBCs powered by AMD Ryzen™ Embedded R-Series SoCs can also help to bring advanced AI inference capabilities to bear.

Learn how AMD is simplifying the Threadripper platform

Computex 2022 Highlights Include AMD Ryzen 6000 Series™ Industry Leading Performance Wins and What's Coming Soon!

At Computex 2022, AMD previewed exciting new details of the Ryzen™ 7000 Series processor and AMD Socket AM5. The exciting new enthusiast platform has many new features, but full support for PCIe® Gen 5 is certainly a star of the show. PCIe® 5.0 brings advanced performance, efficiency and user experience for storage and graphics.  

AMD Ryzen PRO 6000 Series Processors Offer Working Professionals Up to 45% More Battery Life for Video Conferencing

By Matt Unangst

Over the past two years, the pace of PC technology innovation accelerated to keep professional teams connected, productive and secure.

Microsoft recently provided an expanded take on what makes Windows 11 amazing for business-ready PCs. Windows 11 enhances productivity for the next generation of work, strengthens security and privacy, and simplifies corporate device management; together with Microsoft, AMD is thrilled to power these upgraded Windows 11 experiences with new Ryzen and Ryzen PRO laptop and desktop PCs.  AMD and Microsoft have partnered deeply to deliver the most innovative experiences, optimized application performance, and incredible energy efficiency on the Windows 11 platform.

The development and application of 3D chiplet stacking drives the future of AMD’s CPU and GPU technology. But what exactly is this promising, new architecture and what does it offer beyond traditional architectures? Learn more about how 3D chiplet stacking is transforming chiplet packaging technology.

Join AMD at AWS re:Invent November 29-December 3 to learn more about our current Amazon EC2 instances powered by AMD EPYC™ processors and network with other IT industry leaders.