I am working with the AMD Ryzen Embedded R1606G, within the IMB-R1000 Mini-ITX Motherboard of ASRock Industrial in a project that will have this working continuously inside an IP66 or 67 Box, enclosed, which means airtight.
It comes with a fan and heatsinks but I am afraid it wont be of much help as there will be other components inside and air wont be circulating, so it will just be kept and getting hotter as time goes by.
I was thinking that, perhaps, the best idea would be to get rid of the fans and heatsinks and put some thermal paste or pad over it and connect it through heat pipes to the enclosure's inner walls and dissipate it outwards by conductivity alone (as it will count with heat sinks on the outter walls).
Any better ideas or thoughts?
Will it be catastrophic or should it work good enough?
I attach a screenshot of how it comes assembled on the motherboard.
Excuse me if it lacks information or details are not clearly explained.