[General Module Information] Module Number: 3 Module Size: 32 GBytes Memory Type: DDR5 SDRAM Module Type: Unbuffered DIMM (UDIMM) Memory Speed: 3200.0 MHz (DDR5-6400 / PC5-51200) Module Manufacturer: GeIL Module Part Number: CL32-39-39 D5-6400 Module Revision: 0.0 Module Serial Number: N/A Module Manufacturing Date: Year: 2023, Week: 15 Module Manufacturing Location: 1 SDRAM Manufacturer: SK Hynix DRAM Steppping: N/A Error Check/Correction: None [Module Characteristics] Rank Mix: Symmetrical Row Address Bits: 16 Column Address Bits: 10 Module Density: 16384 Mb Dies Per Package: 1 Device Width: x8 Number Of Bank Groups: 8 Banks Per Group: 4 Number Of Ranks: 2 Module Device Width: x4 Channels Per DIMM: x2 Primary Bus Width: x32 Bus Extension: None Module Voltage (VDD): Nominal: 1.1V, Operable: 1.1V, Endurant: 1.1V Module Voltage (VDDQ): Nominal: 1.1V, Operable: 1.1V, Endurant: 1.1V Module Voltage (VPP): Nominal: 1.8V, Operable: 1.8V, Endurant: 1.8V Wide Temperature Sense: Supported Bounded Fault: Supported BL32: Supported Non-Standard Core Timings: Not Supported Minimum SDRAM Cycle Time (tCKAVGmin): 0.41600 ns (2400 MHz) Maximum SDRAM Cycle Time (tCKAVGmax): 1.01000 ns CAS# Latencies Supported: 22, 26, 28, 30, 32, 36, 40, 42 Minimum CAS# Latency Time (tAAmin): 16.666 ns Minimum RAS# to CAS# Delay (tRCDmin): 16.666 ns Minimum Row Precharge Time (tRPmin): 16.666 ns Minimum Active to Precharge Time (tRASmin): 32.000 ns Supported Module Timing at 2400.0 MHz: 41-41-41-77 Supported Module Timing at 2200.0 MHz: 37-37-37-71 Supported Module Timing at 1800.0 MHz: 31-31-31-58 Supported Module Timing at 1600.0 MHz: 27-27-27-52 Minimum Active to Active/Refresh Time (tRCmin): 48.666 ns Minimum Refresh Recovery Time Delay (tRFC1min): 295.000 ns Minimum Refresh Recovery Time Delay (tRFC2min): 160.000 ns Minimum Refresh Recovery Time Delay (tRFCsbmin): 130.000 ns Minimum Refresh Recovery Time Delay (tRFC1dlrmin): 0.000 ns Minimum Refresh Recovery Time Delay (tRFC2dlrmin): 0.000 ns Minimum Refresh Recovery Time Delay (tRFCsbdlrmin): 0.000 ns Activate to Activate Command Delay for Same Bank Group (tRRD_L): 5.000 ns Read to Read Command Delay for Same Bank Group (tCCD_L): 5.000 ns Write to Write Command Delay for Same Bank Group (tCCD_L_WR): 20.000 ns Write to Write Command Delay for Same Bank Group, Second Write not RMW (tCCD_L_WR2): 10.000 ns Four Activate Window (tFAW): 16.666 ns Write to Read Command Delay for Same Bank Group (tCCD_L_WTR): 10.000 ns Write to Read Command Delay for Different Bank Group (tCCD_S_WTR): 2.500 ns Read to Precharge Command Delay (tRTP): 7.500 ns SPD Manufacturer: Montage Technology Group SPD Type: SPD5118 SPD Steppping: 1.5 PMIC0 Device: Present PMIC0 Manufacturer: Richtek Power PMIC0 Device Type: PMIC5100 PMIC0 Stepping: 1.1 PMIC0 Type: Small PMIC (Low Current) PMIC0 Secure Mode: Disabled Thermal Sensor 0: Not Present Thermal Sensor 1: Not Present DRAM Temperature Grade: Extended (XT) : 0 - 95 C Heat Spreader: Not Present Module Nominal Height: 31 - 32 mm Module Maximum Thickness (Front): 1 - 2 mm Module Maximum Thickness (Back): <= 1 mm [Intel Extreme Memory Profile (XMP)] XMP Version: 3.0 Number of PMICs: 1 XMP(OC) PMIC: Supported PMIC OC: Enabled PMIC voltage default step size: 10 mV [Enthusiast/Certified Profile [Enabled]] Profile Name: Recommended Channel Config: 1 DIMM per Channel Module VDD Voltage Level: 1.40 V Module VPP Voltage Level: 1.80 V Module VDDQ Voltage Level: 1.40 V Memory Controller Voltage Level: 1.40 V Minimum SDRAM Cycle Time (tCKAVGmin): 0.31200 ns (3200 MHz) CAS# Latencies Supported: 32 Minimum CAS# Latency Time (tAAmin): 9.984 ns Minimum RAS# to CAS# Delay (tRCDmin): 12.187 ns Minimum Row Precharge Time (tRPmin): 12.187 ns Minimum Active to Precharge Time (tRASmin): 30.000 ns Supported Module Timing at 3200.0 MHz: 32-40-40-97 Minimum Active to Active/Refresh Time (tRCmin): 42.187 ns Minimum Refresh Recovery Time Delay (tRFC1min): 295.000 ns Minimum Refresh Recovery Time Delay (tRFC2min): 160.000 ns Minimum Refresh Recovery Time Delay (tRFCsb): 130.000 ns Minimum Minimum Write Recovery Time (tWRmin): 30.000 ns System Command Rate Mode: Default Real-Time Memory Frequency Overclocking: Supported Intel Dynamic Memory Boost: Not Supported
After many tests, I managed to install XMP, without much stability. Whenever I log in, the BIOS freezes after about 10 seconds (and on-screen artifacts), this forces me to be quick with what I'm going to do inside. I've already tried increasing the VDD MISC electrical voltage a little, but it doesn't help much (although the on-screen artifacts are apparently gone), gaining just a few more seconds.
timingsmemory performance
I activated options like DDR5 NITRO and DDR5 Robust Training Mode. The values of RTTs have been manually adjusted (40-40-120-40-40), the other impedance values are automatic.
although I can even load Windows 11 on the first attempt, just restarting and I get blue screen, so I need to press the reset button on the motherboard to try loading again until I can log in again.
