Please let us know the BGA ball composition for the parts AU1100333MBF and AU1100333MBI
Never heard of Ball Grid Array boards before. But don't know if this AMD Datasheet for the AU1100333MBF can answer your question: https://www.datasheets360.com/part/detail/au1100333mbf/-1345042493621943221/
According to this site AU1100333MBI has the same datasheet as the AU1100333MBF: AU1100333MBI datasheet - Specifications: Data Bus: 32-Bit ; Supply Voltage:
I did not get the actual answer I requested. The BGA ball composition is the alloy composition of the solder ball used in the BGA. Usually it will be like SAC 305, 385 etc.
The BGA ball composition is the alloy used to form the BGA ball in a BGA. It normally looks like SAC 305 SN63PB37.
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I understand, I believe, is you want to know what TYPE of SOLDER composition you need to install the AU1100333MBF and AU1100333MBI on a BGA Board.
That is a technical question that most likely only an AMD Engineer might be able to answer. If no one else is able to find the information or answer your question on this Forum then I suggest you open an AMD EMAIL SUPPORT Ticket to contact AMD SUPPORT directly.
The EMAIL AMD SUPPORT Ticket may be able to give you your answer or maybe direct you on where you can get an answer. Make sure you let them know that this is Business related. Here is the link: Email Form
NOTE: The image you posted, at least on my computer, all I see is a tiny little white dot on a black background.
Noted Thank you.
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