Has anyone any information regarding the removal of the cooling plate from FX series 8 core processor?
Before you think this to be reckless, the Intel chips had a problem some years ago where conduction properties were not ideal, and removing the cover to gain direct conductive contact to the processor was successful.
We're using a bank of FX processors cooled using custom soft copper blocks which feed cooling fluid through large domestic radiators. The cooling fluid is always below 25 degrees and the fluid volume is close to a cubic meter, so the fluctuating temperatures of the processors must be due to conductive properties. Bursts of heat push the temperatures up as high as 50 degrees, then quickly down to about 30 which simply doesn't make sense. We've tried thinned copper blocks and used different conductive fluids; but before we risk damaging the processors we're wondering if any of you "Liquid nitrogen" overclocking junkies have anything to contribute which might help.
Please restrict comment to those who have ACTUALLY experimented in this area. I'm sure there are lots of opinions, but many factors are too lengthy to mention here and we're looking for solutions to this problem of rapid variation in temperature.
AMD solders the head spreader to the processor cores whereas Intel uses thermal paste (because they said it was impossible, AMD proved them wrong), so delidding an AMD processor is extremely hazardous, and since solder conducts heat as thermally efficiently as liquid metal, very little would be accomplished. Also, the thermal maximum of all Bulldozer derived desktop processors is 61*C, so 50*C even if it were 24/7 would not be harmful in any way.