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AMD Engages End-Users at Dassault’s COE Annual Experience and TechniFair

deneffe
Staff
Staff
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[Originally posted on 05/07/18]

A couple of weeks ago I had the pleasure of attending the Dassault COE (Community of Experts) 2018 Annual Experience and TechniFair in San Diego.

This event had a particularly exciting vibe for me as it was packed with genuine end-users of the full Dassault portfolio including CATIA, SOLIDWORKS, SIMULIA, ENOVIA and DELMIA. Also attending were a lot of AMD software and hardware partners.

It was a wonderful opportunity to look at the overall solutions our products enable within the wider ecosystem while focussing on those Dassault users.

It was very insightful to hear about real deployments where our AMD products have been used across PLM deployments to enable a wide range of use cases including:

  • Interactive 3D rendering
  • Cloud delivered CAD
  • Mobile and thin-client end points

Our stand was busy, we were showing CATIA delivered from the cloud and 3D Interactive rendering on HP and Dell. There’s a bit more information about our collaboration with Dassault in this area in this case study.

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Surprisingly we were the only GPU vendor exhibiting, so we attracted a large audience. It was great though to be amongst the full spectrum of the Dassault PLM ecosystem rather than a generic cloud or security conference. Major companies present at the show included HP, Dell and Cisco servers and workstations, to Dassault end-customers like Boeing, Proctor and Gamble and Textron.

My speaking session covered “CATIA from the Cloud”, delivering CATIA from the datacenter with virtualized desktops, and the virtualized graphics considerations for the next generation of 3DExperience and PLM deployment, alongside some details of our S7150 products and MxGPU (shared GPU) technologies.

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This session was particularly insightful because were joined by Keith Horton from Nordam Aerospace, past president of the COE, who described their virtualized CATIA deployment using Cisco C240M5 servers, AMD FirePro™ S7150x2 server GPUs, Citrix XenServer 7.4 with MxGPU capability, and NICE DCV to manage multiple customer design environments and gain benefits in security, remote working and hardware consolidation.

I found it exciting to see how Dassault users are integrating growing technologies into their processes, especially in areas where we at AMD are also investing in GPU applications such as VR/AR (Virtual / Augmented reality) and to support the demands of generative design for uses such as additive manufacture. During the event a new VR and AR Committee within COE was announced, and I think the discussions that will emerge will be worth watching.

If you missed it, it’s worth pencilling it in for next year and checking out the great recap on the COE website.

Last, for those of you in Southern California the week of May 8-10, we will be at Citrix Synergy​.

Where we’ve partnered with HP in booth #311, where we plan to be showcasing graphical applications such as Solidworks, Autodesk Revit and AutoCad delivered from the cloud to HP thin-clients optimized for Citrix deployments with AMD Embedded APUs.

Hope to see there!

Michael DeNeffe, AMD’s Director of Cloud Graphics and has extensive experience in network computing, and client device technologies. Links to third-party sites and references to third-party trademarks are provided for convenience and illustrative purposes only. Unless explicitly stated, AMD is not responsible for the contents of such links, and no third-party endorsement of AMD or any of its products is implied. Use of third-party names or marks is for informational purposes only and no endorsement of or by AMD is intended or implied.

About the Author
Michael DeNeffe is AMD’s Director of Cloud Graphics and has over 25 years of experience in network computing, and client device technologies. He has also held senior management positions at NVIDIA, Teradici, Wyse, Transmeta, and NEC. Over the last ten years, Michael has focused on the emerging and dynamic desktop virtualization market. Prior to is position at AMD, he led the worldwide product marketing effort for NVIDIA GRID technology. Prior to that he was Vice President of Marketing and Business Development for Teradici Corporation and was instrumental in bringing to market the innovative PC-over-IP technology and protocol. And before that, he led the product management and marketing teams for Wyse Technology. There, he launched numerous thin computing products and earned a U. S. patent for the innovative design which is still in the market today. Michael has both undergraduate and master’s degrees from Santa Clara University.