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On June 20, 2017, AMD disrupted the server space in a big way with the announcement of our EPYC™ 7000 series processors, including support from a global ecosystem of customers and partners. Fast forward to the new year and AMD is celebrating the rejuvenation of its embedded solutions by welcoming a new processor to the family.

 

EPYCBlog.jpgThe performance of the “Zen” architecture and datacenter insight from EPYC are infused in the make-up of the company’s next-generation embedded CPU – the AMD EPYC Embedded 3000 processor family. These two distinct and important qualities, architecture and insight, position AMD to help partners and customers take a sophisticated approach to navigating and exploring the shift in computing from the server to the edge.

 

As a result, workloads no longer need to be solely dependent on the core of a network to process and complete intensive tasks. The AMD EPYC Embedded 3000 processor family meets the stringent requirements for the majority of embedded processors, including power management and dependability, while delivering on major advancements in I/O integration, flexibility and security. This advanced processor is ready to support network function virtualization (NFV), software-defined networking (SDN), industrial system applications and more. Additionally, the AMD EPYC Embedded 3000 processor family delivers up to 2.7X more performance-per-dollar[i] and up to 2X more connectivity[ii] than competitive solutions on the market today.

 

At a Glance: EPYC Embedded 3000 Processor Family

 

  • The AMD EPYC Embedded 3000 processor family is based on the ‘Zen’ architecture and a 14nm FinTET process
  • A wide range of core counts, including options for 16, 12, 8 and 4 cores per socket
  • Up to 64 PCIe Gen 3 lanes
  • High-performance single and multithreaded processing
  • Up to 8 channels of 10GbE Ethernet
  • Up to 32MB shared L3 cache with options for 4 independent memory channels
  • TDPs ranging from 30W to 50W (for 1 die and up to 8 cores) and 60W to 100W (for 2 dies and up to 16 cores)
  • Unparalleled enterprise-grade reliability, availability and serviceability (RAS) features
  • Product availability for up to 10 years, offering customers a long lifecycle support roadmap

 

The Ecosystem Perspective: Networking and Communications with Seagate

 

Well-positioned to tackle storage applications in dynamic new ways, Seagate, a world leader in storage solutions, is evaluating the AMD EPYC Embedded 3000 to support the company’s intelligent storage array technologies. With a growing abundance of storage information populated daily, Seagate customers are frequently searching for ways to break down dependability and performance challenges.

 

Seagate is particularly interested in next-generation performance and enterprise-class RAS features to push for an up to 40 percent performance improvement over prior generations of product architectures. The performance gains are no small feat, and Seagate is working to help ensure that customers get the performance they need at an improved total cost of ownership.

 

In addition, AMD continues to work with a variety of customers and partners to deliver processing excellency and impact to workloads across other key industries including networking and industrial applications.

 

Concluding the First Zen-to-Zen Journey

The AMD EPYC Embedded 3000 product family is a nice capstone on the first generation of ‘Zen’-based products, including Ryzen™, EPYC, and now Ryzen™ Embedded and EPYC Embedded. However, this processor is also unique in the ‘Zen’-to-‘Zen’ experience delivered from a family of products that span from the server and the edge. As industries move toward enabling machine learning, AI and internet of things at the edge, the AMD EPYC Embedded 3000 is ready to shape advanced embedded capabilities today and into the future.

 

Cautionary Statement

This blog contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) including the features, functionality, availability, timing, deployment, and expected benefits of the Ryzen™ Embedded V1000 processor and the products being developed by customers based on Ryzen™ Embedded V1000 processor as well as the expected support from major ecosystem partners, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "intends," "believes," "expects," "may," "will," "should," "seeks," "intends," "plans," "pro forma," "estimates," "anticipates," or the negative of these words and phrases, other variations of these words and phrases or comparable terminology. Investors are cautioned that the forward-looking statements in this document are based on current beliefs, assumptions and expectations, speak only as of the date of this document and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Investors are urged to review in detail the risks and uncertainties in AMD's Securities and Exchange Commission filings, including but not limited to AMD's Annual Report on Form 10-K for the year ended December 30, 2017.



[i] Estimates based on SPECint®_rate_base2017 using the GCC-02 v6.1 compiler. AMD-based system scored 24.2 in tests conducted in AMD labs as of 12 January, 2018, configured with 1 x EPYC 3251 SOC ($315 per processor at AMD 1ku pricing), 32GB memory (2 x 16GB 2Rx4 PC4-2666 running at 2666), 1x 250 GB SSD, AMD Wallaby Rev C, RHEL 7.4. Intel Xeon D 1540 scored 16.1. based on tests conducted in AMD labs as of 12 January, 2018 using Supermicro Server System X10SDV-8C-TN4F, configured with 1 x Xeon D 1540 ($581 each processor per ark.intel/com), 32GB memory (2 x 16GB 2Rx4 PC4-2666 running at 2133),  1x 250 GB SSD, RHEL 7.4.EMB-152.

[ii] AMD EPYC™ Embedded 3451 supports up to 64 PCI Express high spend I/O lanes, 8 10 GbE, 16 SATA, and 4 memory channels versus Xeon D 1587 supports 32 PCIe lanes, 4 10GbE, 6 SATA, 2 memory channels. EMB-153.

With a rich history of expertise in embedded solutions, AMD is taking a major leap forward by bringing together the powerful performance of the AMD “Zen” CPU and “Vega” GPU architectures to deliver powerful chip performance and stunning graphics capabilities.

 

RyzenBlog.jpgIntroducing the AMD Ryzen™ Embedded V1000. This next-generation embedded accelerated processing unit (APU) demonstrates the company’s commitment to highly scalable, integrated products with top security features and a dedication to long lifecycle support. With solutions built for the long haul, our latest family of processors will support end-user needs today and tomorrow.

 

Building on the success of AMD integrated embedded APUs, the AMD Ryzen Embedded V1000 processor family delivers an up to 2X boost[i] in processing performance while reducing the design, form factor and thermal management challenges common in discrete CPU and GPU configurations. Not to mention the up to 3X increase in GPU performance over competitive solutionsiv. By coupling a high-performance CPU and GPU on a single die, this marks a new age of embedded processors in terms of performance and graphics capabilities.

 

The result? Users will benefit from significant space savings, smaller board designs and more efficient cooling architectures than what can be achieved with heterogeneous CPU and GPU chipsets. With these capabilities packaged in a small footprint, the AMD Ryzen Embedded V1000 processor family can power up to four independent displays in 4K resolution with the additional ability to support 5K graphics for applications demanding extreme visual clarity, such as medical imaging in an ultrasound machine.

 

At a Glance: Ryzen Embedded V1000 Processor Family

  • High-performance ‘Zen’ CPU and ‘Vega’ GPU on a single die; offers up to 4 CPU cores and up to 11 GPU compute units to achieve processing throughput as high as 3.6 TFLOPS[ii]
  • Up to 200 percent more performance compared to previous generations[iii]
  • Up to 3X more GPU performance than the competition[iv]
  • Up to 46% more multi-threaded performance than the competition[v]
  • Up to 26% smaller footprint than the competition for optimized board design[vi]
  • TDP ranges from 12W to 54W
  • I/O capabilities that support up to 16 PCIe lanes, dual GbE and expansive USB options
  • Ability to drive up to four independent displays running in 4K, with the ability to support 5K graphics for next-generation visual clarity
  • Dual-channel 64-bit DDR4, with performance up to 3200 MT/s
  • Product availability for up to 10 years, offering customers a long lifecycle support roadmap

 

In Action: Displays Driving Healthcare Decisions

Esaote, one of the world’s leading producers of medical diagnostic systems, selected the new AMD Ryzen Embedded V1000 processor family to provide the resolution and graphics capabilities its doctors and technicians rely on to make critical healthcare decisions and complete accurate diagnostics. By delivering the performance and image clarity medical imaging demands, this processor lets Esaote design smaller, more portable ultrasound systems to improve total cost of ownership for their customers and create a better experience for patients.

 

Even more, this processor packs outstanding graphics on a single chip, which delivers significant space and power savings across a variety of markets including medical imaging, casino gaming, media and collaboration as well as digital signage.

 

Looking Ahead: Built for the Long Haul

We focus on anticipating the needs of tomorrow, so our customers can concentrate on delivering advanced applications to create better and more engaging experiences today.

 

The Ryzen Embedded V1000 processor family ushers in a new age of embedded processors and creates a new tier of products for AMD Embedded team, driving unprecedented levels performance and unparalleled support needed to scale with the unknown challenges and advanced applications of tomorrow.

 



[i] Testing done at AMD Embedded Software Engineering Lab. The AMD R-series Embedded SOC formerly codenamed "Merlin Falcon" scored 2399 and the AMD V-series V1807 scored 4978, when running 3dMark® 11P benchmark which measures GPU performance. (4978/2399=2.075) The AMD R-series Embedded SOC formerly called "Merlin Falcon" scored 273 and the AMD V-series V1807 scored 665 on Cinebench R15 nT which measures multi-threaded CPU performance. (665/273= 2.435). AMD Embedded R-Series RX-421BD used a AMD “Bettong” Platform, with a 2x8GB DDR4-2400 RAM, 250GB SSD Drive (non-rotating), TDP 35W, STAPM and ECC Disabled, Graphics Driver 17.40.2011-171026a-320350C-AES, BIOS RBE1306A. AMD Ryzen Embedded V-Series V1807B used the AMD “Dibbler” Platform with 2x8GB DDR4 3200 RAM, 250GB SSD Drive (non-rotating), TDP 35W, STAPM and ECC Disabled, Graphics Driver 17.40-171114a-320676E-AES-2-wRV-E9171, BIOS TDB1100EA.   Both systems ran Microsoft Windows® 10 Pro. EMB-144.

[ii] The equation makes assumptions for clock and uses16-bit floating point operands. FLOPS = 11 CU * 4 SIMD/CU * 4Shaders/SIMD * 4 MAC/Pixel * 4 FLOPS/Cycle/ALU * 1300MHz = 3.661 TFLOPS. EMB-151.

[iii] Testing done at AMD Embedded Software Engineering Lab on the Intel Core i3 -7100U.   The Ryzen 3 2200U was used to approximate the V1202B. The i3-7100U scored 254 and the AMD Ryzen 3 2200U scored 372 on Cinebench R15 nT benchmark which measures multi-threaded CPU performance. System Configurations: Intel Core i3-7100u: HP 15inch Notebook, i3-7100u with Intel® HD Graphics 620, 1x8GB DDR4-2133 RAM, 1 TB 5400 rpm SATA, Microsoft Windows 10 Pro, Graphics Driver 21.20.16.4627, BIOS F.07. AMD Ryzen 3 2200U: AMD “Mandolin” Platform, TDP 15W, STAPM enabled, ECC Disabled 2x4GB DDR4 2400 RAM, 512GB SSD Drive (non-rotating), Microsoft Windows 10 Pro RS3, Graphics Driver 23.20.768.0. EMB-147.

[iv] Comparison is based on performance measured using the 3dMark® 11P benchmark.  The AMD V-series V1807B scored 5618; the Intel Core i7-7700HQ scored 1783. The score for the Intel Core i7-7700HQ was measured using HP Omen with 8GB, Intel® HD 630 Graphics, 1x8GB DDR4 2400 RAM, 1TB 7200rpm HD, Microsoft Windows 10 Pro, Graphics Driver 21.20.16.4627, BIOS F.24. The score for AMD Ryzen Embedded V-Series V1807B was measured using the AMD “Dibbler” Platform, 2x8GB DDR4 3200 RAM, 250GB SSD Drive (non-rotating), TDP 45W, STAPM Enabled, ECC Disabled, Microsoft Windows 10 Pro, Graphics Driver 17.40-171114a-320676E-AES-2-wRV-E9171, BIOS TDB1100EA. EMB-146.

[v] Testing done at AMD Embedded Software Engineering Lab on the Intel Core i3 -7100U.   The Ryzen 3 2200U was used to approximate the V1202B. The i3-7100U scored 254 and the AMD Ryzen 3 2200U scored 372 on Cinebench R15 nT benchmark which measures multi-threaded CPU performance. System Configurations: Intel Core i3-7100u: HP 15inch Notebook, i3-7100u with Intel® HD Graphics 620, 1x8GB DDR4-2133 RAM, 1 TB 5400 rpm SATA, Microsoft Windows 10 Pro, Graphics Driver 21.20.16.4627, BIOS F.07. AMD Ryzen 3 2200U: AMD “Mandolin” Platform, TDP 15W, STAPM enabled, ECC Disabled 2x4GB DDR4 2400 RAM, 512GB SSD Drive (non-rotating), Microsoft Windows 10 Pro RS3, Graphics Driver 23.20.768.0. EMB-147.

[vi] The Intel i7-7700HQ package size in FCBGA1440 is 28mm x 42mm = 1176mm2 versus the V1000 family in FP5 package 25mm x35mm = 875mm2 which is 26% smaller than the i7-7700HQ. Source From intel ARK website: https://ark.intel.com/products/97185/Intel-Core-i7-7700HQ-Processor-6M-Cache-up-to-3_80-GHz. EMB-150.