Skip navigation
1 2 3 Previous Next

AMD Business

147 posts

We are excited to be at SC’19 with our friends and family of ecosystem partners. I’d like to share my thoughts on how AMD has unleashed the EPYC revolution for HPC. AMD is all about innovation and our mission is to deliver products that help to solve the world’s toughest challenges – in life sciences, earth science, energy, manufacturing, fundamental research, oil and gas, machine intelligence and many more. We celebrated our 50th anniversary milestone this year with what analysts called the ‘7nm storm’. The 7nm EPYC, Radeon and Ryzen processors bring new possibilities to the new era of computing with ground-breaking performance and outstanding power efficiency driving lower TCO.

 

Creating an inflection point with trailblazing performance and unprecedented scalability for today’s HPC workloads, AMD EPYC processors mark the next milestone in “exascale computing” characterized by compute power in exaFLOPS, or a quintillion floating-point calculations per second. AMD is uniquely positioned to lead the exascale era with CPU and GPU technologies. We are collaborating with the US Dept of Energy, Cray and Oak Ridge National Laboratory to build the world’s fastest supercomputer named Frontier, expected to hit 1.5 exaflops. This will be five times faster than today’s top supercomputers. Powered by AMD CPUs and GPUs, Frontier will help model the entire lifespan of a nuclear reactor, uncover disease genetics, and build on recent developments in science and technology to further integrate artificial intelligence with data analytics and modeling and simulation.

 

HPC touches every aspects of lives. HPC in the enterprise segment also is being accelerated as many industries are looking for faster and safer solutions for real world problems, challenging the status quo to find breakthrough innovations in fields such as weather modeling and simulation, materials and manufacturing industries, oil and gas, healthcare and medicine, to name a few. HPC requires high performance CPUs.

 

HPC is all about high performance CPUs. AMD EPYC offers a range of processor options for HPC. Let me highlight two specific CPUs from our broad portfolio of processors. EPYC 7542, with 32 cores (2.9GHz base, up to 3.4GHz boost, 225W TDP) and 128MB of L3 cache, has been a popular option in the middle of the market, while EPYC 7742, with 64 cores (2.25GHz base, up to 3.4GHz boost, 225W) and 256MB of L3 cache, has been a popular choice at the high end. New addition to our innovative portfolio is the EPYC 7H12 which packs 64 cores (2.6GHz base, up to 3.3GHz boost, 280W TDP) specifically built for extreme performance. Here are some examples of how AMD EPYC steps up the game, yet again. Our ecosystem partners have announced highly optimized server platform for HPC to address the performance and scalability needs of emerging demands.

 

Faster Weather Forecasting

We are reminded of the importance of weather forecasting every day. AMD EPYC empowers solutions to more efficiently predict weather, including weather-related natural disasters, which helps reduce the enormity of losses caused by these disasters. 

 

The Weather Research and Forecasting (WRF) Model is a popular application for predicting weather. It is used for both atmospheric research and operational weather forecasting applications. It’s data assimilation system and parallel compute capability allows WRF to server a wide range of meteorological applications.

 

AMD EPYC demonstrates exceptional performance and scalability running WRF and AMD EPYC 7742 has been a popular choice for it. With 128 cores and 256 threads in dual CPU configurations EPYC 7742 powered servers have demonstrated approximately twice the performance of our previous generation of EPYC processors. Since WRF is open source, there are no software license costs to consider in choosing the number of cores that you run.

See additional 2nd Gen AMD EPYC performance test reports running WRF use cases here.

 

Building Faster Physical Models through Computational Fluid Dynamics

Computational Fluid Dynamics (CFD) is another critical workload for solving today’s engineering challenges. We have tested several CFD codes and demonstrated industry leading performance on AMD EPYC 7002 series of processors. I want to highlight ANSYS CFX, a popular application which has a long history and is best known for its ability to simulate turbomachinery accurately and quickly.  Let us look at a performance of ANSYS CFX running on two mid-range SKUs – Intel Xeon Gold 6248 processor with 20 cores, 2.5GHz base frequency and 27.5MB cache, and, AMD 2nd Gen EPYC 7542 with 32 cores, 2.5GHX base frequency and 128MB of cache. 

On five standard ANSYS CFX benchmark models, the 2nd Gen AMD EPYC 7542 significantly outperforms the Xeon Gold 6248. Efficiently running this many cores per CPU with stellar results allows for much denser solutions.  More density with better performance allows reductions in total systems required resulting in, lower power, and a smaller footprint in the data center. 

 

Automotive Safety is Top of Mind

Driving a safe car is one of the highest priorities for consumers. Designing a safe car quickly is one of the highest priorities for automotive manufacturers. Designing better and safer products requires the engineers to predict the consequence of any design changes on the real-world performance of their product. 2nd Gen AMD EPYC allows car makers to analyze the safety of their designs faster, leading to safer cars and faster time to market. 

 

Altair Radioss is a leading structural analysis solver and has established itself as a leader and an industry standard for automotive crash, drop & impact analysis, terminal ballistic, blast and explosion effects and high velocity impacts.

Altair Radioss was used to compare the performance of the highest core-count 2nd Gen EPYC processor (AMD EPYC 7742) vs. the highest core-count industry-standard pin-based (LGA) competitive processor (Intel Xeon Platinum 8280).  We ran 2 standard benchmarks on both systems.  The results are summarized below.

Comparing the top of the product stack of 2nd Gen EPYC processors and Intel Xeon Platinum processors, once again demonstrates the dominant performance of the 2nd Gen EPYC processors.  The 7742 is 38% faster on average than the Intel Platinum 8280 across these two benchmark models.

 

See how AMD EPYC supports real world simulation for safety from the performance test results on Radioss.

2nd Generation EPYC processors are truly changing the game in HPC, delivering exceptional performance on real-world workloads.  Talk to your AMD sales team, your software partner, or your server partner to find out which AMD EPYC processor best fits your workload’s demands.  Innovation is in our DNA.  We are just getting started on the EPYC journey to revolutionize HPC!

 

We are grateful to our technology partners who have collaborated with our engineers in creating a wide range of datacenter application use cases:  Altair, Ansys, Atos, Broadcom, Cadence, Cray, Dassault Systems, Dell EMC, Docker, ESI Group, Gigabyte, HPE, LSTC, Mellanox, Mentor Graphics, Microsoft, Micron, Mentor Graphics, Microsoft, Oracle, Red Hat, Samsung, ScaleMP, Siemens PLM, Supermicro, SUSE, Synopsys, WekaIO, Xilinx and others.

 

Raghu Nambiar is the CVP & CTO of Datacenter Ecosystems & Application Engineering for AMD. His postings are his own opinions and may not represent AMD’s positions, strategies or opinions. Links to third party sites are provided for convenience and unless explicitly stated, AMD is not responsible for the contents of such linked sites and no endorsement is implied. 

By Pawel Jaruga, 3D Artist, Poland

 

 

Creative technology for the ages

 

Over the course of my decade-long career as a 3D artist and digital sculptor, there has never been greater opportunity for creative freedom as there is today. With access to powerful software and hardware, professionals in creative industries today are able to put all of their efforts into bringing their vision to life – without being held back by technology.

 

 

At the start of my career, I found that my creative vision was often limited to creating and delivering what was easy, achievable and realistic. A decade on, and with several investments in technology along the way, my creative process – from modelling and texturing to shading and rendering – has allowed me to create increasingly detailed models faster and more seamlessly.

 

In the past, when processors (CPU) and graphic cards (GPU) didn’t have the high-performance capabilities they do today, I found that I was constrained by the number of triangles and faces I could achieve and the textures I could create in a character model.

 

This lack of processing power made things challenging when I was working from home using a single workstation as everything took so long, especially when creating animations. Even the difference in hardware now compared to three years ago has given my workflow a huge boost.

 

In my everyday workflow, I now use the 3D sculpting software Zbrush and several GPU renderers including AMD Radeon ProRender, while my hardware includes AMD Radeon Pro WX 9100 Graphics (provided to me by AMD) and an 8-Core 4.0 GHz processor with 64GB RAM. With previous hardware a few years ago, I was creating models where 20-50 million triangles models were considered a lot for a freelancer. But today, my workstation can handle upwards of 200 million triangles. So for high poly models going up to 70-120 million of triangles is nothing special anymore.

 

Meanwhile, for texturing, I use Substance Painter and 3D Coat and my hardware includes at least 8GB of video memory. This is really the minimum you can have for texturing a standard game character with a 4096-texture set, which means a resolution of 4096 x 4096 pixels. This is a huge jump from the start of my career, back when the texture limit was 1024 x 1024 per character.

 

 

Technology advancements such as these have not only allowed us creatives to develop more realistic and vivid characters, but have also enabled real-time rendering, which means I can see any changes as I make them, resulting in a much faster workflow. I also have the ability to produce photorealistic images that help create a highly detailed and believable 3D world.

 

You can also easily light scenes and models with single HDRI images and include photogrammetry scans in your modelling workflow – real world items and human 3-dimensional scans based on photo sets taken around objects, which can also include high resolution textures.

 

Overall, this helps make the creative process much more fun, as you’re not having to wrestle with your hardware. There really has never been a better time to be a video game designer.

 

Best ever performance, best ever value

 

The affordability of software and hardware tools has continued to improve, to support this technology journey toward creative freedom, and 3D artists and developers can now focus on using superior software and their skills to their full potential.

 

 

However, how you balance performance and value depends on your needs. My requirements change depending on whether I’m earning money from rendering work, or whether I’m modelling and texturing high-end video game characters where I need to be able to work in real-time with multiple 4K textures sets. Or whether I’m creating simple models for mobile games or lower-end video games, where I don’t need to display as many textures at once. As I need a lot of video memory, it can be difficult to find the right balance, but I will always buy the best GPU I can afford to help boost my workflow.

 

How a diverse industry creates diverse thinking

 

3D artists come into the field from diverse backgrounds, both technical and artistic. To be a 3D artist, you need some creative skill, but creativity is something you can nurture throughout your career. As for technical skills, if you don’t already possess these you can learn (although it’s harder if you don’t have a background in computing). Saying that, today’s software tools are far more accessible and user-friendly, helped by powerful hardware that speeds up the workflow and improves performance. For instance, nowadays you don’t have to start modelling with a base mesh, you can create forms and shapes without using any mathematical or technical approach. So effectively whatever jumps out of your head can materialise as a 3D model.

 

 

While technical skills and an artistic background will make your first steps in your career as a 3D artist easier, patience is also a key skill, as you’ll need to work for many hours a day to hone your craft. I recently taught two people from scratch, neither of whom had much experience with specialised computer software, and now they are working as successful professional 3D artists. Both have a high level of patience, persistence and a willingness to learn and develop.

 

Being Polish, it’s also exciting to see the growth of this industry in my home country. We have great 3D artists and developers here, and with today’s modern technology, we are now afforded the same level of creative freedom as those users in western Europe and America, where the biggest productions are made.

 

Our home-grown game development industry is evolving, with studios including Flying Wild Hog, The Astronauts, 11 Bit Studios, CI Games, Techland, People Can Fly and CD PROJEKT RED – of course, the much-anticipated Cyberpunk 2077 is on the way next year. Not only are these companies attracting employees from around the world but investors too, drawn by the investment opportunities in our local industry.

 

 

AR & VR: The next frontier

 

While powerful hardware is currently used to provide the best possible experience to users via a screen in front of them – through the use of, for example, AMD FreeSync Technology and 8K screens – the next frontier will be immersive experiences, such as VR and AR.

 

 

The professional applications of VR and AR is already advancing, with 3D artists using headsets such as Oculus and HTC Vive to sculpt and draw in VR. This will be the next step on our collective technology journey and an extremely exciting one for creatives here in Europe and beyond.

 

 

 

About Pawel Jaruga

 

Pawel "Levus3D" Jaruga is a character artist, digital sculptor and instructor based in Poland. He has over 10 years’ experience in games, commercials and cinematics industry. He’s also the owner of Creepytables.com, miniatures and collectibles studio. You can view his work here.

 

Notable game credits:

  • Witchfire (The Astronauts, TBC)
  • Hard Reset: Redux (Flying Wild Hog, 2016)
  • Shadow Warrior 2 (Flying Wild Hog, 2016)
  • Ryse: Son of Rome - Legendary Edition (Crytek/Microsoft, 2014)
  • Ryse: Son of Rome (Crytek/Microsoft, 2013)
  • Shadow Warrior (Flying Wild Hog, 2013)
  • Hard Reset: Exile (Flying Wild Hog, 2012)
  • Hard Reset (Flying Wild Hog, 2011)
  • Ancient Quest of Saqqarah (Codeminion, 2008)
  • Stoneloops! of Jurassica (Codeminion, 2008)

 

Specific focus areas:

  • 3D Design, Modelling and Printing
  • Character Design and Modelling
  • Creature Design and Modelling
  • Digital Sculpting
  • Physically Based Rendering
  • Texturing

 

Software used:

  • AMD ProRender
  • Zbrush
  • 3DCoat
  • 3DS Max
  • Blender
  • Marmoset
  • Marvelous Designer
  • Octane Render
  • Substance Painter

 

Pawel Jaruga received a Radeon Pro WX9100 graphics card in exchange for his blog contribution. The blog represents Mr. Jaruga’s own thoughts and opinions as of the date published. AMD and/or the third-party blogger have no obligation to update any forward-looking content in the above blog. AMD is not responsible for the content of any third-party and does not necessarily endorse the comments made therein. Links to third party sites are provided for convenience and unless explicitly stated, AMD is not responsible for the contents of such linked sites and no endorsement is implied.

Today I am excited to let you know that the AMD EPYC Cloud footprint is increasing globally with Tencent Cloud announcing its 2nd Gen AMD EPYC processor-based “Star Lake” Server Platform at the Tencent Global Digital Ecosystem Conference.

 

Let’s take a closer look at the latest Tencent Cloud announcement and how the 2nd Gen AMD EPYC processor-powered “Star Lake” platform enables Tencent Cloud to achieve their business goals and extend performance & TCO advantages to their customers.

 

Enhanced efficiency and scalable performance for exponentially growing cloud service

Tencent recently became the first Chinese company with more than 1.1 million servers in their network and is one of the fastest growing cloud computing companies in the global IaaS market. This rapid business growth brings new challenges including efficiency improvement and operational cost reduction for the infrastructure. To address these challenges Tencent Cloud developed a technology system from the infrastructure layer to the application layer to enable the next stage of cloud computing growth.

 

Server design, energy efficiency, security features, and reliability have a direct impact on the performance and cost efficiency of Cloud Service Provider offerings. The 2nd Gen AMD EPYC processor based “Star Lake” server platform is Tencent’s first self-designed server developed for the Tencent Cloud environment. Tencent employed many advanced capabilities to improve energy efficiency. For example, according to Tencent, the advanced thermosyphon heat dissipation technology used in “Star Lake” improves maximum load energy efficiency by 50%. The “Star Lake” platform is designed to optimize cloud computing, storage and network requirements to effectively meet 98% of Tencent cloud application scenarios.

 

Liu YuXun, General Manager of Tencent's server supply chain Announcing the AMD EPYC<img src='https://community.amd.com/images/emojis/2122.png' class='jive_emoji'/> Powered Star Lake Server Platform at the Tencent Global Digital Ecosystem Conference, 2019.

Liu YuXun, General Manager of Tencent's server supply chain Announcing the AMD EPYC Powered Star Lake Server Platform at the Tencent Global Digital Ecosystem Conference, 2019.

 

Industry's best single core performance and significant single core TCO savings with 2nd Gen AMD EPYC Processor Powered “Star Lake” server

According to test results presented by Tencent Cloud at the Tencent Global Digital Ecosystem Conference, the “Star Lake” Server with Tencent’s SA 2 instance powered by 2nd Gen AMD EPYC processors achieved the industry’s best single core performance and provides a significant TCO advantage. Tencent Cloud’s results in the image above show that the 2nd Gen AMD EPYC processor-based “Star Lake” server platform improves the overall performance of Tencent’s SA 2 cloud service instances by 35%, including 40% improvement in video processing, 35% improvement in graphics transcoding and 150% improvement in page QPS. This enables Tencent Cloud to provide performance enhancements and cost efficiencies to end customers.

 

You can read more about this at the Tencent Cloud Star Lake Announcement here. It's in Mandarin but can be translated easily!

 

I greatly appreciate the close collaboration and efforts of the Tencent Cloud and AMD teams to bring these innovations to our customers.

We at AMD are proud to be at the forefront of innovation through our collaboration with Microsoft Azure to offer our latest innovations to cloud-based enterprises with the general availability of the new Azure D-series and E-series virtual machines powered by AMD EPYC 7452 Processors. AMD and Microsoft Azure will continue our collaboration to provide guidance on optimization & migration to Azure virtual machines powered by AMD EPYC Processors. AMD and Microsoft are also expanding their partnership with Azure Data Explorer, a leading managed data analytics service for near real-time ingestion and ultra-fast queries.

 

Operational cost efficiency, space optimization, and faster application response times are critical for today’s modern data centers. Architectural innovations in AMD EPYC 7002 Series processors are designed to deliver exceptional performance and scalability to help drive TCO savings for users of a variety of cloud environments including traditional bare metal, software defined, converged and hyper-converged infrastructures in private, public, and hybrid cloud environments.

 

Let’s take a quick look at how Azure and AMD EPYC continue to give customers leadership performance for cloud workloads.

 

Enhanced Performance with Azure D-series virtual machines powered by AMD EPYC

Microsoft considers the Azure Da_v4 and Das_v4-Series the fastest Azure VMs in their class, with a balanced core-to-memory ratio, providing enhanced performance for a wide variety of production workloads. Example use cases include most enterprise-grade applications, relational databases, in-memory caching, and analytics. Microsoft Azure D-series virtual machines are powered by AMD EPYC 7452 Processors and provide up to 96 vCPUs, 384GB DDR4 RAM, and 2.4TB of SSD-based temporary storage per virtual machine.

 

Optimize large in-memory business critical workloads with Microsoft Azure E-Series virtual machines powered by AMD EPYC

Azure Ea_v4 and Eas_v4 VMs offer class-leading performance for memory-intensive applications such as relational databases, caching servers, and in-memory analytics. Powered by AMD EPYC 7452 Processors, the E-Series offer up to 96 vCPUs, up to 672GB DDR4 memory, and 2.4TB SSD-based temporary storage per VM. For database workloads, the Ea-series VMs offers a 22% better performance/dollar than competitive VMs. [i]

 

Power a lightning fast data exploration engine

AMD and Microsoft are expanding their partnership with Azure Data Explorer, a leading managed data analytics service for near real-time ingestion and ultra-fast queries. Azure Data Explorer is using commercially available Azure compute powered by AMD EPYC to deliver groundbreaking and cost-effective interactive analytics.

 

Microsoft Ignite offers a great opportunity to explore innovative ways to build solutions, migrate and manage your infrastructure, using the new Azure D-series and E-series virtual machines powered by AMD EPYC processors.

 

In addition, there are plenty of chances to learning the latest skills from technology leaders and industry users shaping the future of cloud. AMD is hosting a technical breakout session (BRK1114: “Turbocharge your infrastructure with AMD EPYC”) on Thursday, November 7 at 11:30AM-12:15PM in OCCC W208. You can also come by meeting room MR-32, Sponsor Rooms B in the Partner Solution Zone for a deeper dive into our innovative technologies or join us at Booth # 249 to experience solution demos and interact with AMD experts.

 

You can also read more about the new Azure VMs on the Microsoft blog, here.

 

I would like to thank the Microsoft and AMD teams who partnered to bring these innovations to our customers.

 

[i] "Results as of 10-28-2019 using MS SQL Server 2019. Comparison based on internal testing of HammerDB TPCC/OLTP workload. Azure E16asv4 virtual machine generated a result of 600K transactions/minute and costs $0.5301/hour based on three year reserve pricing in US East with RHEL operating system. Pricing found at https://azure.microsoft.com/en-us/pricing/details/virtual-machines/red-hat/. AWS r5.4xlarge virtual machine generated a result of 545K transactions/minute and costs $0.587/hour based on effective hourly 3-year reserve pricing in US East region with RHEL operating system. Pricing found at https://aws.amazon.com/ec2/pricing/reserved-instances/pricing/ ROM-340

In today’s world, computer security is becoming very important due the exponential increase in malware and ransomware attacks. Various studies have shown that a single malicious attack can cost companies millions of dollars and can require significant recovery time. With the growth of employees working remotely and connected to a network considered less secure than traditional corporate network, employee’s computer systems can be perceived as a weak security link and a risk to overall security of the company. Operating System (OS) and independent hardware vendors (IHV) are investing in security technologies which will make computers more resilient to cyberattacks.

 

Microsoft recently announced their Secured-core PC initiative which relies on a combined effort from OEM partners, silicon vendors and themselves to provide deeply integrated hardware, firmware and software for enhanced device security. As a leading silicon provider to the PC market, AMD will be a key partner in this effort with upcoming processors that are Secured-core PC compatible.

 

In a computer system, low level firmware and the boot loader are initially executed to configure the system. Then ownership of the system is handed over to the operating system whose responsibility is to manage the resources and to protect the integrity of the system.

 

In today’s world, cyberattacks are becoming increasingly sophisticated, with threats targeting low level firmware becoming more prominent. With this changing paradigm in security threats, there is strong need to provide end customers with an integrated hardware and software solution which offer comprehensive security to the system.

 

This is where the Microsoft Secured-core PC initiative comes into the picture. A Secured-core PC enables you to boot securely, protect your device from firmware vulnerabilities, shield the operating system from attacks and prevent unauthorized access to devices and data with advanced access controls and authentication systems.

 

AMD plays a vital role in enabling Secure-Core PC as AMD’s hardware security features and associated software helps safeguard low level firmware attacks. Before we explain how AMD is enabling Secured-Core PC in next gen AMD Ryzen products, let’s first explain some security features and capabilities of AMD products.

 

SKINIT: The SKINIT instruction helps create a “root of trust” starting with an initially untrusted operating mode. SKINIT reinitializes the processor to establish a secure execution environment for a software component called the secure loader (SL) and starts execution of the SL in a way to help prevent tampering SKINIT extends the hardware-based root of trust to the secure loader.

 

Secure Loader (SL): The AMD Secure Loader (SL) is responsible for validating the platform configuration by interrogating the hardware and requesting configuration information from the DRTM Service.

 

AMD Secure Processor (ASP): AMD Secure Processor is dedicated hardware available in each SOC which helps enable secure boot up from BIOS level into the Trusted Execution Environment (TEE). Trusted applications can leverage industry-standard APIs to take advantage of the TEE’s secure execution environment.

 

AMD-V with GMET: AMD-V is set of hardware extensions to enable virtualization on AMD platforms. Guest Mode Execute Trap (GMET) is a silicon performance acceleration feature added in next gen Ryzen which enables hypervisor to efficiently handle code integrity check and help protect against malware.

 

Now let’s understand the basic concept of firmware protection in a Secured-core PC. The firmware and bootloader can load freely with the assumption that these are unprotected code and knowing that shortly after launch the system will transition into a trusted state with the hardware forcing low level firmware down a well-known and measured code path. This means that the firmware component is authenticated & measured by the security block on AMD silicon and the measurement is securely stored in TPM for further usage by operating systems including verification and attestation. At any point of time after system has booted into OS, the operating system can request AMD security block to remeasure and compare with old values before executing with further operations. This way the OS can help ensure integrity of the system from boot to run time.

 

The firmware protection flow described above is handled by AMD Dynamic Root of Trust Measurement (DRTM) Service Block and is made up of SKINIT CPU instruction, ASP and the AMD Secure Loader (SL). This block is responsible for creating and maintain a chain of trust between components by performing the following functions:

  • Measure and authenticate firmware and bootloader
  • To gather the following system configuration for the OS which will in turn validate them against its security requirements and store information for future verification.
    • Physical memory map
    • PCI configuration space location
    • Local APIC configuration
    • I/O APIC configuration
    • IOMMU configuration / TMR Configuration
    • Power management configuration

 

Whilst the above methods help in safeguarding firmware, there is still an attack surface that needs to be protected, the System Management Mode (SMM). SMM is a special-purpose CPU mode in x86 microcontrollers that handles power management, hardware configuration, thermal monitoring, and anything else the manufacturer deems useful. Whenever one of these system operations is requested, an interrupt (SMI) is invoked at runtime which executes SMM code installed by the BIOS. SMM code executes in the highest privilege level and is invisible to the OS. Due to this, it becomes attractive target for malicious activity and can be potentially used access hypervisor memory and change the hypervisor.

 

Since the SMI handler is typically provided by a developer different then the operating system and SMM handler code running at a higher privilege has access to OS/Hypervisor Memory & Resources. Exploitable vulnerabilities in SMM code leads to compromise of Windows OS/HV & Virtualization Based Security (VBS). To help isolate SMM, AMD introduces a security module called AMD SMM Supervisor that executes immediately before control is transferred to the SMI handler after an SMI has occurred. AMD SMM Supervisor resides in AMD DRTM service block and the purpose of AMD SMM Supervisor is to:

 

  • Block SMM from being able to modify Hypervisor or OS memory. An exception is a small coordinate communication buffer between the two.
  • Prevent SMM from introducing new SMM code at run time
  • Block SMM from accessing DMA, I/O, or registers that can compromise the Hypervisor or OS

 

To summarize, AMD will continue to innovate and push boundaries of security in hardware, whether it is DRTM service block to help protect integrity of the system, the use of Transparent Secure Memory Encryption (TSME) to help protect data or Control-flow Enforcement technology (CET) to help prevent against Return Oriented Programming (ROP) attacks. Microsoft is a key partner for AMD and as part of this relationship there is a joint commitment with the Secured-core PC initiative to improve security within software and hardware to offer a more comprehensive security solution to customers.

 

 

Akash Malhotra is Director of Security Product Management at AMD. His postings are his own opinions and may not represent AMD’s positions, strategies or opinions. Links to third party sites are provided for convenience and unless explicitly stated, AMD is not responsible for the contents of such linked sites and no endorsement is implied.

At AMD, we are excited to celebrate Exascale Day along with Oak Ridge National Laboratory and Cray, a Hewlett Packard Enterprise Company, as our research and development teams are hard at work to change the world of computing with the groundbreaking Frontier supercomputer.

 

Frontier is expected to be the most powerful supercomputer of all time when it goes live, with an expected performance upwards of 1.5 exaFLOPS, or 1.5 billion, billion calculations per second. Powered by AMD EPYC™ CPUs, Radeon™ Instinct GPUs, Radeon Open eCosystem (ROCm) and EPYC open source software, Frontier targets more than five times faster performance than the world’s current reigning fastest supercomputer.

 

We are optimizing AMD Radeon Instinct GPUs and AMD EPYC CPUs in a 4:1 GPU to CPU configuration which will allow us to achieve high throughput of data. AMD’s Infinity Fabric will support high-speed connections between processors and allow Frontier to hit historic, sustained high-performance computation across the system.

 

As we approach and pass the barrier of exascale computing, the Frontier supercomputer opens up new possibilities for scientific research. Oak Ridge National Labs, Cray and AMD have created the Center for Accelerated Application Readiness (CAAR) program to develop applications designed for problems which only Frontier can help solve:

 

  •       Princeton University: to simulate future states of the Milky Way galaxy using massive amounts of satellite and telescope data in an astrophysical simulation code called Cholla.
  •       ORNL: to use a codebase known as Combinatorial Metrics (CoMet) to study the genetics of opioid addiction and toxicity, chronic pain, Alzheimer’s, and autism.
  •      Georgia Institute of Technology: to run GPUs for Extreme-Scale Turbulence Simulations (GESTS) to simulate turbulence with nearly 35 trillion grid points in order to better understand fluid turbulence as it relates to pollution, ocean currents and astrophysics.
  •      Virginia Polytechnic Institute and State University: to study the Lattice Boltzmann Methods of Porous Media (LBPM) code to understand the volumetric maps of mineral composition in order to train neural networks to predict future geometric configuration of fluids.
  •      ORNL: to run calculations of realistic condensed matters from first principles (FP) calculations, previously inaccessible before Frontier, through the Locally Self-Consistent Multiple Scattering (LSMS)
  •      University of Illinois at Urbana-Champaign: to use Frontier in conjunction with codebase Nanoscale Molecular Dynamics (NAMD) to understand viruses like Zika and pave the way for new drugs and vaccines to prevent future outbreaks.
  •      Michigan State University: to study complex-time dependent phenomena at the particle level such as nuclear reactions and fission through symmetry-projection techniques on a code called Nuclear Coupled-Cluster Oak Ridge (NuCCOR).
  •      University of Delaware: to develop advanced particle accelerators for radiation therapy of cancer, high energy physics, and photon science using code Particle-in-cell on Graphics Processing Units (PIConGPU).

 

This list inspires the work we do every day, as it takes the millions of hours of work that has gone into the latest AMD processors and brings it to life in tangible ways that will truly change the future. AMD is proud to be at the forefront of innovation and discovery through our collaboration with Cray and Oak Ridge National Laboratory. Working together with these exceptional technology partners and the researchers Frontier aims to empower, we can redefine the future of high-performance data centers and  have a profound effect on advancing science and technology.  

 

Cautionary Statement

This blog contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) including, but not limited to, the expectations and benefits of the Frontier supercomputer, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this blog are based on current beliefs, assumptions and expectations, speak only as of the date of this blog and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Investors are urged to review in detail the risks and uncertainties in AMD's Securities and Exchange Commission filings, including but not limited to AMD's Quarterly Report on Form 10-Q for the quarter ended June 29, 2019.

The AMD Embedded business provides SoCs and discrete GPUs that enable casino gaming companies to create immersive and beautiful graphics for the latest in casino gaming platforms, which are adopting the same high-quality motion graphics and experiences seen in modern consumer gaming devices.

 

AMD Embedded provides casino and gaming customers a breadth of solutions to drive virtually any gaming system. The AMD Ryzen Embedded V1000 SoC brings CPU and GPU technology together in one package, providing the capability to run up to four 4K displays from one system. The AMD Ryzen Embedded R1000 SoC is a power efficient option while providing up to 4X better CPU and graphics performance per dollar than the competition[i].

 

Bringing New Embedded GPU Options to Customers

Beyond SoCs, AMD also offers embedded GPUs to enable stunning, immersive visual experiences while supporting efficient thermal design power (TDP) profiles. AMD delivers three discrete GPU classes to customers with the AMD Embedded Radeon ultra-high-performance embedded GPUs, the AMD Embedded Radeon high-performance embedded GPUs and the AMD Embedded Radeon power-efficient embedded GPUs. These three classes enable a wide range of performance and power consumption, but most importantly offer features that the embedded industry demands including planned longevity, enhanced support and support for embedded operating systems.  

 

Continuing to provide our customers with more choice, high performance and better power efficiency, we are launching two new versions of the AMD Embedded Radeon GPUs, the E9560 and the E9390. These two new cards are in the PCIe form factor, use 8GB of GDDR5 memory and support 4K high-speed video, 3D visualizations and other compute-intensive graphics applications seen in the casino and arcade gaming.

 

For customers that need the superior performance with an Embedded GPU, the E9560 delivers up to 11%[ii] more performance compared to the existing E9550. It does this with 36 compute units, a TDP of 130W or less and up to 5.7 theoretical TFLOPS of performance.

 

For the customer that is looking for better power efficiency, the E9390 has a TDP of 75W or less with 28 compute units and provides up to 3.9 theoretical TFLOPS of performance.

 

Beyond more choice, we’ve heard from our customers about an area of concern when it comes to graphics processors. The memory used by graphics cards, GDDR5, is being phased out across the industry for an updated standard, GDDR6. To help our customers manage this transition, the E9560 and E9390, as well as our existing ‘Polaris’ architecture E-Series GPUs will have planned availability until 2022.

 

New Platforms Based on AMD Embedded Processors

Our ability to provide customers with high-performance CPUs and GPUs that can power the video and graphics demanded by modern gaming is evident in the companies bringing new systems to the market:

  • Casino Technology, a casino gaming company based in Europe, just announced its support for the AMD Ryzen Embedded V1000 SoC, bringing discrete-GPU caliber graphics and multimedia processing to their slot machine customers.
  • Quixant announced a new generation of gaming controllers, the QXi-7000 LITE, are using the AMD Ryzen Embedded R1000 SoC, enabling game design to be pushed to the limit.

 

Come by the AMD booth #3814 at the G2E Casino Gaming convention and you can see how AMD embedded solutions provide the eye-catching graphics and enable the rewarding experiences of next-gen gaming, from touch screens to 3D graphics and more. As well, the booth will have numerous solutions and systems from other casino and gaming companies using AMD embedded products including Advantech, Axiomtech, iBase Gaming, IGT, Scientific Games, Sapphire and TUL

 

Stephen Turnbull is the director of product management and business development, Embedded Solutions, AMD. His postings are his own opinions and may not represent AMD’s positions, strategies or opinions. Links to third party sites are provided for convenience and unless explicitly stated, AMD is not responsible for the contents of such linked sites and no endorsement is implied.  GD-5

 

[i] Testing done at AMD Embedded Software Engineering Lab on 3/13/2019.  The AMD R1505G Embedded scored 360 running CineBench R15 Multi-core and 1,988 running 3DMark11 benchmarks. The Intel Core i3-7100U (Kaby Lake) scored 254 running CineBench R15 Multi-core and 1,444 when running 3DMark11 benchmark which measures Graphics performance.  Recommended Customer price for Intel Core i3-7100U is $261 as of 4/1/2019 (check https://ark.intel.com/content/www/us/en/ark/products/95442/intel-core-i3-7100u-processor-3m-cache-2-40-ghz.html). DBB price for R1505G is $80. System Configurations: AMD Embedded R1505G used an AMD R1505G Platform, with a 2x8GB DDR4-2400 RAM, 250GB SSD Drive (non-rotating), TDP 15W, STAPM Enabled and ECC Disabled, Graphics Driver 18.50_190207a-339028E-AES, BIOS RBB1190B, Microsoft Windows 10 Pro. The Intel Core i3-7100u used an HP 15inch Notebook with i3-7100u with Intel HD Graphics 620, 1x8GB DDR4-2133 RAM, 1 TB 5400 rpm SATA, Microsoft Windows 10 Pro, Graphics Driver 21.20.16.4627, BIOS F.07.  EMB-159

[ii] Testing conducted by AMD Performance Labs as of 10/09/2019 on the AMD Radeon Embedded E9550 PCIe module and AMD Radeon Embedded E9560 PCIe module on an AMD Dibbler Embedded reference platform using 3DMark 11. Results may vary. EMB-163

Introducing the AMD Ryzen 5 and AMD Ryzen 7 Microsoft Surface Edition Processors: A New Level of Responsiveness and Speed in an Ultra-Slim Design

We are thrilled to announce the new AMD Ryzen Surface Edition processors built exclusively for Microsoft Surface Laptop 3. This is the first-ever 15” Surface laptop from Microsoft, with AMD computing and graphics technology under the hood.

The new Microsoft Surface Laptop 3 extends the long-standing collaboration between Microsoft and AMD from the world of Xbox console gaming to the PC. Just as we have done with our Xbox collaboration, AMD and Microsoft set out several years ago with a shared vision to bring the best of both companies together to revolutionize the laptop. Thanks to the tens of thousands of hours of co-development work to combine the fastest AMD mobile processor for ultrathin laptops with significant software and system optimizations from Microsoft, the Microsoft Surface Laptop 3 delivers the best user experience in an ultra-slim laptop. The co-engineering behind the Surface simultaneously provides unprecedented performance and all-day battery life in a sleek, lightweight design at only 3.4 lbs. Like an expertly crafted and finely tuned racecar, Microsoft Surface Laptop 3 offers a unique user experience through several key performance features.

Microsoft Surface Design Team

Photo: With Brett Ostrum, CVP, Microsoft Surface and Microsoft Surface Design Team

Key performance features to unlock while “driving” Microsoft Surface Laptop 3:

  • Go from idle to full boost in the blink of an eye: We challenged ourselves to improve Smart Performance Shift with enhanced highly tuned predictive algorithms that adapt to the end-user workload on-demand, delivering a perfect balance of battery life and peak performance under virtually any situation. This re-engineered approach provides a hybrid-turbo-like capacity for bursts up to 4 GHz of “Zen+” CPU performance or take what is already the world’s fastest performing graphics for ultrathin laptops to new heights when needed. 
  • Effortless acceleration when needed: The specifically customized AMD Ryzen Microsoft Surface Edition processor inherits from the graphics core architecture of Xbox One and includes one additional compute unit more than any other AMD Ryzen mobile processor for an extra boost of graphics horsepower. Complex content creation and machine learning workloads seamlessly offload to the massive parallel-processing GPU engine through AMD Radeon  OpenCL and WinML drivers. Microsoft Surface Laptop 3 harnesses the power of its compute and graphics resources to drive demanding content creation and gaming workloads in an ultrathin laptop.
  • Crystal clear, vivid display: Connected to a world-class GPU engine with AMD FreeSynctechnology controlling a high resolution (200 DPI) display. Lean back and enjoy movies or games smoothly on-the-go, building upon the same leadership Radeon GPU technology found in the Xbox One X. AMD’s wide color gamut and display color calibration enable vivid on-screen colors in games and videos that better match real life.
  • Dynamic responsiveness: A fully optimized pen interface delivers unparalleled precision through the revolutionary on-die pen controller. The fully optimized pen software stack takes up to 200 measurements per second. Paired with the optimized Bluetooth stack, Windows scheduling priority, and foreground application boost – the pen has never been more powerful.
  • Roadside assistance: Re-architected system software from firmware capsule storage to recovery of critical system functions gives peace of mind that the system is stable, robust, and protected from failures.  
  • Be heard even in a crowded arena: Next-level voice detection optimized to perform even in noisy or echo-filled environments powered by a superior DSP algorithm – the Microsoft Surface Laptop 3 voice assistant is always on, always ready for the next spoken request.
  • A quick start is everything: Fast storage access delivers the highest performance from the internal SSD, dramatically reducing application start, system boot, and file copy times. 
  • No need for pit-stops: The system constantly monitors vital processor and skin temperatures to deliver the highest performance possible while keeping Microsoft Surface Laptop 3 cool to the touch.  A new Windows system management framework enables the processor to directly negotiate the power policy with the OS.  Microsoft added specific optimizations for the first time in the Windows OS to ensure that all the applications have the best environment to shine.
  • Always connected: Power and performance-optimized WiFi stack with Modern Standby delivers super-fast transfer speeds when needed most and always stays connected on-the-go.
  • Stay cool while in the driver’s seat: Microsoft Surface Laptop 3 is performance-modeled for maximum thermal management headroom through thousands of hours of thermal simulations. The ultimate combination of processor thermal calibration and containment, and system thermal dissipation sustains those demanding content creation and gaming workloads.

 

This is just the beginning of an exciting relationship and co-engineering with the Surface team, and we look forward to continued collaboration that pushes the boundaries of what is possible in technology and gaming.

We can’t wait for users to take Microsoft Surface Laptop 3 for a spin. This amazing new, ultra-slim laptop will truly satisfy their need for speed.

Paven Davuluri (Microsoft), Panos Panay (Microsoft), Lisa Su (AMD), Jack Huynh (AMD), Sebastien Nussbaum (AMD)

Photo: Pavan Davuluri, Distinguished Engineer, Microsoft Surface; Panos Panay, Chief Product Officer, Microsoft Surface; Lisa Su, AMD CEO; Jack Huynh, CVP & GM, Semi-Custom, AMD; Sebastien Nussbaum, CVP, Engineering, Semi-Custom, AMD

                                                                                                                                                                                           

Jack Huynh is Corporate Vice President and General Manager for AMD's Semi-Custom Group.

On August 7 this year, AMD changed the data center market with the launch of the 2nd Gen AMD EPYC processor, the world’s first 7nm and highest performance x86 data center CPU[i]. We hosted an amazing launch event in San Francisco, joined by leading industry partners including Google, Twitter, HPE, Lenovo and others, where we showcased the world record performance[ii], breakthrough architecture and broad ecosystem support for the 2nd Gen AMD EPYC family.

 

Since launch, we have seen significant traction with customers and partners. They recognize the overall breakthrough performance, and the superior single socket performance of the 2nd Gen EPYC vs. the competition. As well, they know our higher core counts and support for compelling features like PCIe 4.0 make AMD EPYC the right choice for the future of the data center.

 

Today, we are proud to have new platforms from Dell and new customers pledging to use the 2nd Gen AMD EPYC for cloud, HPC and even 5G. And with the original codename of “Rome,” what better place to reach this next round of milestones than Rome, Italy.

 

Earlier today I was joined by our CTO Mark Papermaster, as well as our incredible European team and customers, to share the latest progress with our 2nd Gen AMD EPYC processors and introduce our newest customers. Here are the highlights:

 

  • Yesterday, Dell EMC announced five new PowerEdge platforms using the 2nd Gen AMD EPYC processor. These platforms were designed from the ground-up and optimized to support the features of the new AMD EPYC processor including PCI 4.0. You can read more about the new PowerEdge systems here, including purchasing details for the new systems that are available now.
  • Satinder Sethi, GM of IBM Cloud infrastructure, joined me to discuss how IBM Cloud views performance and works to deliver it to its customers. Enterprises moving to cloud want higher levels of performance to support compute-intensive workloads for AI and big data, without jeopardizing security. Security is a critical component of IBM’s hybrid cloud strategy, and technologies like 2nd Gen EPYC with SEV-ES help drive new levels of security in the hybrid cloud era. IBM Cloud customers are also asking for better memory bandwidth for big data and analytics workloads. With 45% greater memory bandwidth in its class,[iii] 2nd Gen EPYC provides fantastic memory bandwidth scaling for big data and analytics workloads. Finally, the core scaling and breakthrough performance of 2nd Gen EPYC provides a superior quality of service and a higher level of performance for container workloads. IBM plans to have more to share in 2020 about its new performance offerings for clients.
  • Nokia joined AMD CTO, Mark Papermaster, on stage and talked about the potential performance implications of the 2nd Gen AMD EPYC processor for 4G and 5G networks. Nokia has tested 2nd Gen AMD EPYC processors in its Cloud Packet Core system, which helps service providers deliver converged broadband, IoT, and machine-type communication services while evolving to a 5G core. In these tests, the 2nd Gen AMD EPYC processors are providing an 80% increase in packet throughput performance compared to previous solutions. This means that with AMD EPYC, Nokia is providing its customers better capacity, performance and scale for their networks.
  • European pure player cloud provider OVHcloud showcased an upcoming high-end hosting instance that is based on the 2nd Gen AMD EPYC processor, specifically the EPYC 7402P. The EPYC processor is used in a full flash server and the instances will be available at the end of 2019.
  • TSMC joined us on stage to highlight its capacity and capabilities for 7nm fabrication and it also announced its adoption of AMD EPYC processors helping power its next gen research and leading process technology
  • Finally, ATOS and its customer Genci, which fosters the use of supercomputing for the benefit of French scientific communities, joined me to highlight Genci’s use of the ATOS BullSequana X system using the 2nd Gen AMD EPYC processor. Genci specifically chose the 2nd Gen EPYC due to its TCO and fantastic sustained performance efficiency per watt. Additionally, ATOS and AMD showcased a new 2nd Gen AMD EPYC SKU specifically designed for HPC customers that need the highest performance and can support liquid cooling. The AMD EPYC 7H12 is a 64 core/128 thread, 280W part[iv] with a 2.6Ghz base frequency and 3.3Ghz max boost frequency that performs ~11% better at LINPACK compared to the AMD EPYC 7742[v] in testing by ATOS on their BullSequana XH2000 platform. The AMD EPYC 7H12 is being used by Genci, CSC Finland and Uninett in Norway.

 

Today we continued to take EPYC to new heights. We are thrilled to have the ecosystem supporting us across hardware, software and cloud providers as we face the challenges of the modern data center head-on with 2nd Gen AMD EPYC. You can find numerous OEMs and channel partners that are selling platforms with the new EPYC processors here.

 

Expect to hear more from us and our partners this year as we continue to expand our reach with the 2nd Gen AMD EPYC processor.

 

Forrest Norrod is the SVP and GM of the Datacenter and Embedded Solutions Group at AMD. His postings are his own opinions and may not represent AMD’s positions, strategies or opinions. Links to third party sites are provided for convenience and unless explicitly stated, AMD is not responsible for the contents of such linked sites and no endorsement is implied.  GD-5

 

Cautionary Statement

This blog contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) including, but not limited to the features, functionality, performance, availability, timing, expectations and expected benefits of the 2nd Gen AMD EPYCTM processors and the expected timing and benefits of new partner offerings,  which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this blog are based on current beliefs, assumptions and expectations, speak only as of the date of this blog and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Investors are urged to review in detail the risks and uncertainties in AMD's Securities and Exchange Commission filings, including but not limited to AMD's Quarterly Report on Form 10-Q for the quarter ended June 29, 2019.

 

 

[i] A 2P EPYC 7742 processor powered server has SPECrate2017_int_peak score of 749, and a int_base score of 682 https://spec.org/cpu2017/results/res2019q3/cpu2017-20190722-16242.html as of August 7, 2019. The next highest peak score is a 2P Intel Platinum 9282 server at 676, base 643: http://spec.org/cpu2017/results/res2019q3/cpu2017-20190624-15369.pdf as of July 28, 2019. SPEC, SPECrate and SPEC CPU are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information. ROM-91.

[ii] See https://www.amd.com/en/processors/epyc-world-records for details.

[iii] EPYC 7002 series has 8 memory channels, supporting 3200 MHz DIMMs yielding 204.8 GB/s of bandwidth vs. the same class of Intel Scalable Gen 2 processors with only 6 memory channels and supporting 2933 MHz DIMMs yielding 140.8 GB/s of bandwidth. 204.8 / 140.8 = 1.454545 - 1.0 = .45 or 45% more.  AMD EPYC has 45% more bandwidth. Class based on industry-standard pin-based (LGA) X86 processors. ROM-11

[iv] EPYC 7H12 processor boost frequencies may be achieved only with a cooling solution that meets group ‘Z’ requirements.  Achievable boost frequencies may vary depending on the effectiveness of the actual cooling solution. ROM-282

[v] Based on Atos testing of HPL v2.1 benchmark, as of September 13, 2019, using a 2P AMD EPYC 7H12 powered production server versus AMD internal testing of HPL v2.1 benchmark, as of July 17, 2019, using a 2P AMD EPYC 7742 powered AMD reference server. AMD has not independently verified the 7H12 scores. Results may vary. ROM-287

This is an EPYC revolution! The history of AMD innovation continues today with the launch and availability of select AMD EPYC 7002 Series Processors. The second-generation milestone in the AMD EPYC family builds on the disruptive datacenter products that AMD first established with the original EPYC 7001 Series. With the first 7nm x86 server technology, first PCIe Gen 4 readiness1, and the first x86 server architecture with DDR4-32001 we bring expectation-shattering performance and exceptional scalability to your data center ecosystem with our new lineup.

 

Architectural innovations in AMD EPYC 7002 Series Processors are designed to deliver exceptional performance with unique security features, for a variety of workloads that matter to you -  on traditional bare metal, software defined, converged and hyper-converged infrastructures in private, public, and hybrid cloud environments. We know today’s connected world is unleashing huge quantities of data every second. Data center operational cost efficiency, space optimization, and faster application response times are critical.  AMD EPYC addresses them all and today we are announcing 80 world records across our ecosystem.

 

Let’s take a closer look at how the ecosystem around AMD EPYC 7002 Series Processors enable support for your business:

 

Ready today with support for major operating systems and hypervisors

AMD has close relationships and joint engineering engagements with major operating systems and hypervisor vendors enabling key features and optimizations. A key focus of AMD EPYC 7002 Series Processors are the security features to help defend your CPU, applications, and data. Data centers around the globe are constantly adapting to securely meet the current workload demands while planning for future needs. Secure Memory Encryption (SME) uses a single key to encrypt system memory and Secure Encrypted Virtualization (SEV) and further extends that feature by enabling each guest in a public or private cloud instance to be encrypted by a unique key. With SME and SEV, users can have greater confidence the security capability surrounding their private data. The growing community of operating system vendors that support SEV includes Canonical, Fedora, Oracle, RedHat, and SUSE. VMware has also committed to support AMD security features in a future release of vSphere.

Comprehensive offering in High Performance Computing (HPC)

High performance computing (HPC) powers new technology advancements in academia and a wide array of industries across both the public and private sectors. Scientific research, public health, climate modeling, as well as oil and gas exploration are just a few examples where HPC is the driving force behind new innovations and knowledge discovery. (AMD CPUs and GPUs will power the new Frontier exascale supercomputer at Oak Ridge National Laboratory in 2021.) Innovative architecture of AMD EPYC 7002 Series brings tremendous performance and scalability for HPC applications, offering you a choice in x86 architecture while optimizing total cost of ownership.

 

The 4Vs of Big Data Analytics

Data is growing at exponential rates, often characterized by the 4Vs - Volume, Velocity,  Veracity and Value - big data analytics is fueling the digital transformation across industry, research and governments. The demand for computing power is increasing apace, but often IT budgets and data center space are not. AMD EPYC processors’ single socket with no compromise on features can offer the performance and efficiency for a broad set of big data analytics applications. World record benchmark results from our partners clearly demonstrate the high performance and lower cost of ownership advantages one processor can have compared to two socket systems from small to large scale.  Combined with larger and faster memory, massive I/O throughput and a high-speed network you can be ready to face any big data challenge.

 

Don’t forget Relational Databases

Relational databases continue to be central to mission-critical applications from transactional operations to decision support systems. The emergence of mobile technology is redefining the e-commerce across industry verticals. Complex online transactions and analytics to gain insights in real-time is a must for staying ahead in business today. AMD EPYC 7002 Series Processors bring hi-speed memory and high performance I/O to support high performance for data intensive applications. We are happy to announce new industry leading performance benchmark results today using relational database management systems with our ecosystem partners.

 

Number of virtual machines surpassed the number of physical machines a long time ago. It’s all about clouds – private and public

The AMD EPYC 7002 Series value proposition is simple: more cores open the door for more virtual machines, better consolidation, lower cost, and simpler management. 7nm technology enables powerful and efficient processors that are capable of delivering more performance at the same power2. AMD EPYC 7002 Series Processors' high core count, DDR4-3200 capable memory, high performance IO and connectivity with PCIe 4.0, security features and compelling energy efficiency are a strong match for today’s highly virtualized data center. Outstanding performance in VMmark, SPECvirt and TPCx-V are testaments to performance and efficiency. This provides strong value for all kinds of virtual environments, including VM dense applications (such as VDI), Containers, hyperconverged solutions (such as vSAN, Nutanix, HPE SimpliVity) and cloud native applications.

 

Offering the latest and greatest from the hardware ecosystem

We have a long history of being the first to bring key technologies to market. Today we announce support for PCI 4.0, doubling the bandwidth from PCIe 3.0. Double the bandwidth is a HUGE improvement from the previous generation of AMD EPYC processors and first in the x86 server world.  This is a tremendous advantage in the data center, and will enable significant reduction in network interfaces cards, switch ports, cables, and of course management points. PCIe 4.0 also enables faster connectivity to high speed GPUs and accelerators, as well as NVMe devices.

 

We owe a big thanks to our partners

Today would not be possible without the incredible support of our ecosystem partners. Our broad partner ecosystem and collaborative engineering provide solutions that help deliver high performance and efficiency at lower total cost of ownership.

 

We are grateful to our partners who have collaborated with our engineers for a wide range of datacenter use cases:

Altair, Ansys, AWS, Beamr, Broadcom, Cadence, Canonical, Citrix, Cloudera, Cloudian, Couchbase, Dassault Systèmes, DataStax, Docker, ESI Group, Exasol, LSTC, MapR, Mavenir, Mellanox, MemSQL, Mentor Graphics, Microsoft, Micron, MongoDB, NetScout, MapR, Mavenir, Mentor Graphics, Microsoft, MongoDB, NetScout, Nokia, Nutanix, Oracle, Quobyte, Red Hat, Redis Labs, SAP, SAS, Samsung, ScaleMP, Siemens PLM, Splunk, StorMagic, SUSE, Synopsys, Transwarp, TigerGraph, Vertica, VMware, WekaIO, Xilinx.

 

 

 

Check out our documents here: Solutions Briefs and Performance Briefs.

 

 

  1. Some supported features and functionality of second-generation AMD EPYC processors (codenamed “Rome”) require a BIOS update from your server manufacturer when used with a motherboard designed for the first-generation AMD EPYC 7000 series processor.  A motherboard designed for “Rome” processors is required to enable all available functionality. ROM-06.
  2. EPYC-07: Based on June 8, 2018 AMD internal testing of same-architecture product ported from 14 to 7 nm technology with similar implementation flow/methodology, using performance from SGEMM. EPYC-07

I’m pleased to announce AMD has joined other industry leaders in the Compute Express Link (CXL) Consortium. 

 

Compute Express Link (CXL) is an open industry standard interconnect offering high-bandwidth, low-latency connectivity between host processors, systems and devices such as accelerator cards, memory buffers, and smart I/O devices. Designed to address the increasing demands of high-performance computational workloads, CXL targets heterogeneous processing and memory systems across a range of high-performance computing applications by enabling coherency and memory semantics between processors and systems. This is increasingly important as processing data in Artificial Intelligence and Machine Learning requires a diverse mix of scalar, vector, matrix and spatial architectures across a range of accelerator options.

 

Since 2016 AMD has played a leadership role in driving three other new bus/interconnect standards, CCIX, OpenCAPI and Gen-Z.  Like CXL, these three efforts are driven by the need to create tighter coupling and coherency between processors and accelerators, and better exploit new and emerging memory/storage technologies in open, standards-based solutions.

 

While these different groups have been working to solve similar problems, each approach has its differences. As a long-standing supporter of open standards, we’re excited to join CXL and the possibilities presented as we work with other ecosystem leaders to address challenges we face as an industry.

 

If you’d like more information on CXL.  Please go to https://www.computeexpresslink.org/

 

MARK PAPERMASTER  

Executive Vice President and  Chief Technology Officer

Our strong momentum continues to grow! Last week, we celebrated a solid first quarter and our company’s 50th anniversary. Today , Lisa joined U.S. Department of Energy (DOE) Secretary Rick Perry, Oak Ridge National Laboratory (ORNL ) Director Thomas Zacharia and Cray CEO Peter Ungaro to announce that AMD EPYCTM CPUs, Radeon Instinct GPUs, and Radeon Open Ecosystem (ROCm) and EPYC open source software will power what is expected to be the world’s fastest supercomputer, called “Frontier.”

 

ORNL’s Frontier supercomputer aims to deliver more than 1.5 exaflops of performance. That level of performance exceeds the combined performance of today’s 160 fastest supercomputers! Scheduled to be online in 2021, the Frontier system will allow researchers to advance science in such applications as systems biology, materials science, energy production, additive manufacturing and health data science. Visit the Frontier website  to learn more about the areas of exploration.

 

AMD is delighted to partner with the DOE, Cray and ORNL to push the frontiers of HPC and lead the industry into the exascale era. This is one of the finest examples of a public and private partnership. AMD has a long history of working on HPC and is a strong partner for ORNL and DOE. In 2012, the DOE started a series of programs to push research that would enable future exascale compute systems. As part of this, AMD Research collaborated on FastForward, DesignForward, and PathForward – DOE programs that include public/private partnerships focused on key areas of chip, system, and software development to push the boundaries of high-performance computing. As the collaboration progressed, it evolved from research to product development, with exascale technologies incorporated into both our EPYC CPUs and Radeon Instinct GPUs for the datacenter. This partnership and shared vision around exascale computing drove our selection as the CPU and GPU provider for the Frontier project. We are incredibly excited to be a part of this program.

At the heart of the Frontier system is a future AI and HPC optimized AMD EPYC processor and a purpose-built AMD Radeon Instinct GPU in a 4:1 GPU to CPU configuration. The Radeon Instinct GPU also contains high-bandwidth memory allowing it to achieve very high throughput of data, while keeping power low and saving space. AMD’s Infinity Fabric will support high-speed connections between processors. The joint optimization of all these elements together enables us to hit this historic performance in each node of the system. Cray’s Slingshot scalable interconnect will handle the complex processing and communication of HPC and AI applications between nodes and between cabinets. The Frontier system will be supported by an enhanced version of AMD’s ROCm programming environment for AMD CPUs and GPUs.

 

Our strategy at AMD is about enabling high performance computing and we have an incredibly strong CPU and GPU roadmap, now more than ever optimized together. We believe supercomputing is at the forefront of the computer architecture innovation. Technology that is driving systems like Frontier is re-defining the standard for future high-performance datacenters.

 

Thank you to the thousands of dedicated employees who had a hand in this project. The science that the Frontier system enables will help solve some of the world’s toughest and most important challenges. This is another very proud day for AMD and demonstrates to the world that we have the technologies, vision and talent to lead the high-performance computing industry forward.

 

MARK PAPERMASTER  

Executive Vice President and  Chief Technology Officer

 

FORREST NORROD

Senior Vice President and General Manager

Datacenter and Embedded Solutions Group  

As AMD celebrates 50 years as a company, one of our latest innovations for the enterprise, the AMD EPYC™ processors, have gained momentum across datacenter and cloud computing segments. One of the key areas where we see tremendous traction is in hyperconverged infrastructures (HCI). Today we are excited to announce a technology partnership with Nutanix, an established leader in hyperconvergence delivering a full software stack that integrates compute, virtualization, storage, networking and security to power applications at scale.

 

AMD and Nutanix have worked together on optimizing Nutanix’s hyperconverged software, Acropolis OS, on AMD EPYC processors. The teams have been collaborating closely for several months and look forward to bringing Nutanix validated EPYC processor-based servers to the market from leading server OEM manufacturers.

Nutanix has already embarked on the path for enabling choice in hypervisors by enabling support for its own AHV, as well as VMWare ESXi®, and Microsoft® Hyper-V, and with the enablement of these hypervisors on EPYC, AMD and Nutanix will be increasing x86 CPU choice for datacenter customers.

 

Together AMD and Nutanix are bringing out the true value of the EPYC processor, leveraging its impressive PCIe® connectivity, memory bandwidth and memory capacity. In addition to the TCO savings that customers can get with Nutanix hyperconvergence software, AMD and Nutanix are optimizing on AMD EPYC processor-powered single socket servers to enable even further TCO savings to datacenter customers. We expect the combined EPYC processor + Nutanix solution to shine on several workloads such as VDI, virtualized storage, and containerized applications.

 

EPYC Processor Hyperconvergence

The AMD EPYC processor is ideally suited for hyperconvergence by providing high performance compute coupled with impressive I/O for native connectivity to storage. EPYC System-on-Chip (SoC) performance scales linearly and uniformly across cores helping minimize performance variation within applications.

Designed from the ground up for a new generation of solutions, AMD EPYC implements a philosophy of choice without restriction. Choose the number of cores and sockets that meet your needs without sacrificing key features like memory and I/O.

Each EPYC SoC can have from 8 to 32 cores with access to incredible amounts of I/O and memory regardless of the number of cores in use, including 128 PCIe® lanes, and support for up to 2 TB of high-speed memory per socket.

The AMD + Nutanix journey has just begun. Stay tuned for updates; fully supported Nutanix solutions on EPYC based OEM servers are planned for summer 2019.

 

AMD is proudly sponsoring Nutanix.NEXT 2019. We look forward to seeing you at the event where you can learn more on the value that Nutanix and AMD bring to customers deploying HCI.

 

Raghu Nambiar is the CVP & CTO of Datacenter Ecosystems & Application Engineering at AMD. His postings are his own opinions and may not represent AMD’s positions, strategies or opinions. Links to third party sites are provided for convenience and unless explicitly stated, AMD is not responsible for the contents of such linked sites and no endorsement is implied.  GD-5

We understand your business. You need fast devices to keep up with your business, security features to help keep your data safe and manageability to keep your fleet organized and up to date. Upgrade Your Experience and Get more from your notebook with 2nd Gen AMD Ryzen™ PRO and Athlon™ PRO processors.

 

Get More Productive

No one likes dealing with slow and unresponsive notebooks. With all those tasks running in the background from virus scanners to OS updates, a system can start to feel a little sluggish.
Our latest Ryzen™ 7 PRO 3700U processor with up to 4 cores and 8 threads is up to 2.8 times faster than our older AMD PRO A12-9800B APUs.1 Ryzen™ PRO processors represent AMD’s next generation of performance, which means less waiting and more doing at the workplace.

 

Get More Creative

Radeon™ Vega Graphics is not just for gaming but also helps accelerate the workplace. Premium graphics helps employees drive 4K displays for additional screen real estate, accelerate media playback for smooth video and speeds up creative tasks. With a Ryzen™ PRO mobile processor with Radeon™ Vega Graphics experience up to 36% faster photo editing, 64% faster 3D modeling and 258% faster medical visualization over the competition.2,3

 

Get More Portable

No power outlets available? No Problem. Notebooks powered by Ryzen™ PRO and Athlon™ PRO processors are designed for the 9-5 workday. Get up to 12 hours of general office use or up to 10 hours of video playback with the AMD Ryzen™ PRO 7 3700U processor. 4

 

Get More Security Features

The global average cost of a data device breach is $3.86 Million.5 Ryzen™ PRO processors help protect against malicious data attacks from the moment of power-on with Secure Boot, lock down Windows 10 enterprise systems with Microsoft Device Guard enhanced with AMD GuardMI technology and help defend against attack to your system RAM (aka Cold Boot Attacks) with memory encryption. AMD Ryzen™ PRO and Athlon™ PRO processors is the only processor family with full memory encryption as a standard security feature. 6

 

Get More Pro Options

With AMD PRO processors we don’t force you to purchase premium more expensive solutions to get the security and professional features that enterprises need. So whether you want a Ryzen PRO 7, 5, 3 or Athlon Pro processors, you can choose the right performance level you need for your business without sacrificing on enterprise security and manageability features.

 

Click Here to learn more about the new 2nd Gen Ryzen™ PRO and Athlon™ PRO processors.

 

 

David Tjong, Product Marketing Manager for AMD. His postings are his own opinions and may not represent AMD’s positions, strategies or opinions. Links to third party sites are provided for convenience and unless explicitly stated, AMD is not responsible for the contents of such linked sites and no endorsement is implied. GD-5

 

1. Testing conducted by AMD Performance Labs as of January 10, 2019. Cinebench 1T used to measure CPU Single Thread Performance. Performance presented in A12-9800B (100%) vs Ryzen 7 PRO 3700U scored a 152.0475, Ryzen 7 PRO 2700U scored a 140.1425 while the A12-9800B scored a 84.75 for a comparison of 152.0475/84.75=1.79 and 140.1425/84.75=1.65 respectively. Cinebench nT used to measure CPU Multi Thread Performance. Performance presented in A12-9800B (100%) vs Ryzen 7 PRO 3700U scored a 688.4775, Ryzen 7 PRO 2700U scored a 634.345 while the A12-9800B scored a 240 for a comparison of 688.4775/240=2.87 and 634.345/240=2.64 respectively. PCMark 10 used to measure System Performance. Performance presented in A12-9800B (100%) vs Ryzen 7 PRO 3700U scored a 4075.5, Ryzen 7 PRO 2700U scored a 3494 while the A12-9800B scored a 2547.33 for a comparison of 4075.5/2547.33=1.60 and 3494/2547.33=1.37 respectively. 3DMark 11 Performance used to measure Graphics Performance. Performance presented in A12-9800B (100%) vs Ryzen 7 PRO 3700U scored a 4432.25, Ryzen 7 PRO 2700U scored a 4125 while the A12-9800B scored a 1947 for a comparison of 4432.25/1947=2.28 and 4125/1947=2.12 respectively. System Configurations: AMD Ryzen™ 7 PRO 3700U, 2x4GB DDR4, Radeon™ Vega 10 Graphics (driver 25.20.14102.16), Samsung 850 Pro SSD, Windows® 10 Pro x64 AMD Ryzen™ 7 PRO 2700U, 2x4GB DDR4, Radeon™ Vega 10 Graphics (driver 25.20.14102.16), Samsung 850 Pro SSD, Windows® 10 Pro x64 AMD PRO A12-9800B, 2x4GB DDR4, Radeon™ R7 Graphics (driver 22.19.662.4), Samsung 850 Pro SSD, Windows® 10 Pro x64 PCMark and 3DMark are registered trademarks of Futuremark Corporation. PC manufacturers may vary configurations yielding different results. All scores in are an average of 3 runs with the same settings. Performance may vary based on use of latest drivers. PP-7
2. Testing conducted by AMD Performance Labs as of January 10, 2019 “Photo Editing defined as a scripted series of photo filters in Photoshop presented in i7-8650U (Dell Latitude 7490) (100%) vs Ryzen 7 PRO 3700U took 52.9 seconds to complete, while the i7-8650U took 71.9 seconds for a comparison of (71.9-52.9)/52.9=1.36 | SPECView Perf 13 3DSMax used to measure 3D Modeling Performance. Performance presented in i7-8650U (Dell Latitude 7490) (100%) vs Ryzen 7 PRO 3700U scored a 24.265 while the i7-8650U scored a 14.7525 for a comparison of 24.265/14.7525=1.64 | SPECView Perf 13 Medical used to measure Medical Viewset Performance. Performance presented in i7-8650U (Dell Latitude 7490) (100%) vs Ryzen 7 PRO 3700U scored a 7.84 while the i7-8650U scored a 2.19 for a comparison of 7.84/2.1875=3.58 | PCMark 10 DCC Subtest used to measure Content Creation Performance. Performance presented in i7-8650U (Dell Latitude 7490) (100%) vs Ryzen 7 PRO 3700U scored a 3595.25 while the i7-8650U scored a 3162 for a comparison of 3595.25/3162=1.14 | System Configurations: AMD Ryzen™ 7 PRO 3700U, 2x4GB DDR4, Radeon™ Vega 10 Graphics (driver 25.20.14102.16), Samsung 850 Pro SSD, Windows® 10 Pro x64 | Intel i7-8650U, Dell Latitude 7490, 2x4GB DDR4, Intel UHD 620 Graphics (driver 22.20.16.4799), Samsung 850 Pro SSD, Windows® 10 Pro x64 PC manufacturers may vary configurations yielding different results. All scores in are an average of 3 runs with the same settings. Performance may vary based on use of latest drivers. PP-10
3. Testing conducted by AMD Performance Labs as of January 10, 2019 Photo Editing defined as a scripted series of photo filters in Photoshop presented in i5-8350U (Dell Latitude 7490) (100%) vs Ryzen 5 PRO 3500U took 56.1 seconds to complete, while the i5-8350U took 75.4 seconds for a comparison of (75.4-56.1)/56.1=1.34 | SPECView Perf 13 3DSMax used to measure 3D Modeling Performance. Performance presented in i5-8350U (Dell Latitude 7490) (100%) vs Ryzen 5 PRO 3500U scored a 23.8125 while the i5-8350U (Dell Latitude 7490) scored a 14.06 for a comparison of 23.8125/14.06=1.69 | SPECView Perf 13 Medical used to measure Medical Viewset Performance. Performance presented in i5-8350U (Dell Latitude 7490) (100%) vs Ryzen 5 PRO 3500U scored a 7.2825 while the i5-8350U (Dell Latitude 7490) scored a 2.1125 for a comparison of 7.2825/2.1125=3.45 | PCMark 10 DCC Subtest used to measure Content Creation Performance. Performance presented in i5-8350U (Dell Latitude 7490) (100%) vs Ryzen 5 PRO 3500U scored a 3404.25 while the i5-8350U (Dell Latitude 7490) scored a 2977.5 for a comparison of 3404.25/2977.5=1.14 | System Configurations: AMD Ryzen™ 5 PRO 3500U, 2x4GB DDR4, Radeon™ Vega 8 Graphics (driver 25.20.14102.16), Samsung 850 Pro SSD, Windows® 10 Pro x64 | Intel i5-8350U, Dell Latitude 7490, 2x4GB DDR4, Intel UHD 620 Graphics (driver 22.20.16.4799), Samsung 850 Pro SSD, Windows® 10 Pro x64 | PC manufacturers may vary configurations yielding different results. All scores in are an average of 3 runs with the same settings. Performance may vary based on use of latest drivers. PP-11
4. Testing by AMD performance labs as of 12/4/2018. “Battery life” defined as hours of continuous usage before the system automatically shuts down due to depleted battery. Video playback tested according to Microsoft WER methodology, while “general usage” is tested via MobileMark® 2014 1.5. Results presented in minutes, in order of: 1st Gen AMD Ryzen™ 7 2700U Mobile Processor (100%) vs. 2nd Gen AMD Ryzen™ 7 3700U Mobile Processor. General Usage: Ryzen™ 7 2700U: 8.1 hours vs. Ryzen™ 7 3700U: 12.3 hours (51% longer). Video Playback: Ryzen™ 7 2700U: 6.9 hours vs. Ryzen™ 7 3700U: 10 hours (40% longer). Ryzen™ 7 2700U Test System: Lenovo IdeaPad 530s, Ryzen™ 7 2700U, 2x4GB DDR4-2400, Radeon™ Vega10 Graphics (driver 23.20.768.0), 1920x1080 AUO 403D 13.9” panel, 512GB Toshiba KBG30ZMT512G SSD, 45Whr battery, 150 nits brightness, Windows® 10 x64 RS4. Ryzen™ 7 3700U Test System: AMD Reference Motherboard, AMD Ryzen™ 7 3700U, 2x4GB DDR4-2400, Radeon™ Vega10 Graphics (driver 23.20.768.0), AUO B140HAN05.4 14” panel, 256GB WD Black WD256G1XOC SSD, 50Whr battery, 150 nits brightness, Windows® 10 x64 RS5. Results may vary with drivers and configuration. RVM-164
5. According to IBM research, for details refer to: https://www.ibm.com/security/data-breach
6. For general business laptops and desktops the AMD Transparent Secure Memory Encryption feature is included in AMD Ryzen PRO and Athlon PRO processors. PP-3

While numerous HPC workloads benefit from the core performance and industry leading memory bandwidth[i] of the AMD EPYC™ 7000 series process family there’s a set of workloads that only scale when they get access to one thing, speed.

 

In industries using processes like Electronic Design Automation (EDA), where designers are constantly testing and validating designs, workloads only scale to a limited number of threads. This is when single core clock frequency becomes a critical factor. The faster the core runs, the more work that can be done in a defined amount of time.

 

After we launched the AMD EPYC 7000 series processor, we started getting the questions from customers running EDA workloads saying, “We need a high-frequency EPYC processor, when will you have it?” They loved the core density, the memory bandwidth and the I/O capacity that EPYC provides, but for their workloads, they simply needed more speed.

 

In November we showed those customers that we were listening and introduced the brand new EPYC 7371 processor, a new high-frequency product in the EPYC 7000 series family. Providing 16 cores at 3.6Ghz all core boost and a 3.8Ghz max boost for eight cores, the AMD EPYC 7371 is a perfect processor for workloads like EDA and high-performance computing that need access to higher frequency speeds. For AMD, the EPYC 7371 is particularly important as we race towards time to market with our next generation 7nm parts in the CPU and GPU space. You can read more here about how the EPYC 7371 helped us do that with the recently announced 7nm, Radeon™ VII products.

 

And now the first AMD EPYC 7371 systems are available, providing the high-frequency core performance that EDA and similar workloads need. There are numerous OEMs that are supporting the EPYC 7371 processor in their platforms.

For HPE customers, it is available in the fantastic HPE ProLiant DL385 Gen 10 server, which is purpose built to address to address HPC workloads of all kinds. Supermicro is supporting the EPYC 7371 across their entire AMD portfolio, including the BigTwin and Ultra lines that are popular among HPC and enterprise customers. We expect additional OEMs like ASUS, Gigabyte and Tyan to announce their support for the EPYC 7371 in the coming months.

 

Beyond high-frequency speeds for EDA workloads, the 7371 gives customers using software with a core-based licensing structure like ANSYS Fluent a benefit. Having a lower core count and a higher frequency processor allows them to get the best performance for their application, while optimizing their licensing costs without having to sacrifice memory and I/O.

 

No matter if you are running EDA, HPC, or any other workloads that need access to high-frequency cores combined with incredible memory bandwidth and expansive I/O capabilities, the AMD EPYC 7371 is the right choice, providing the performance and price needed to get work done, with speed and cost, efficiently.  

 

Daniel Bounds is the senior director of product management of the AMD Datacenter Solutions Group. His postings are his own opinions and may not represent AMD’s positions, strategies or opinions. Links to third party sites are provided for convenience and unless explicitly stated, AMD is not responsible for the contents of such linked sites and no endorsement is implied.  GD-5

 

[i] NAP-42 – AMD EPYC™ 7601 processor supports up to 8 channels of DDR4-2667, versus the Xeon Platinum 8180 processor at 6 channels of DDR4-2667